IECC 2026--Ei Compendex and Scopus

Full Name: 2026 8th International Electronics Communication Conference
Abbreviation: IECC 2026
Place: Wuhan, China
Date: December 11-13, 2026
Website: www.iecc.net

Sponsored by: South-Central Minzu University
Organized by: College of Electronics and Information Engineering (School of Robotics), South-Central Minzu University

2026 8th International Electronics Communication Conference (IECC 2026) will be held from December 11-13, 2026, in Wuhan, China. The conference is sponsored by South-Central Minzu University, and organized by College of Electronics and Information Engineering (School of Robotics). IECC will not only focus on breakthroughs and challenges in key areas such as communication architecture, signal processing, network optimization, and converged applications but also strive to provide a bridge for scholars from academia, industry, and research institutions worldwide—especially early-career researchers—to showcase achievements, inspire thinking, and foster collaboration, thereby jointly shaping the future of next-generation communication technologies. Researchers, practitioners, and students from around the world are warmly invited to submit their contributions.



☛ CALL FOR PAPERS
Authors are invited to submit full papers describing original research work in areas including, but not limited to:

1. Next-Generation Wireless Communications
Track Chair: Assoc. Prof. Helin Yang, Xiamen Uiversity, China
Reconfigurable Intelligent Surfaces (RIS): programmable wireless environments, channel modeling, phase shift control, and RIS-aided transmission
Terahertz Communications: devices, antennas, beamforming, channel characterization, and system integration for 6G
Integrated Sensing and Communications (ISAC): joint waveform design, sensing-assisted communication, resource allocation, and performance trade-offs
Cell-Free Massive MIMO: architecture, distributed signal processing, fronthaul design, and user-centric clustering
Semantic and Goal-Oriented Communications: beyond bit transmission, semantic encoding, task-driven compression, and AI-native protocols
Millimeter-wave and Sub-THz systems: propagation modeling, beam management, and hardware impairments

2. Optical Communications and Fiber Networks
Space Division Multiplexing: few-mode and multi-core fiber transmission, mode coupling, MIMO-DSP, and spatial channel modeling
Coherent Optical Communications: advanced modulation formats, digital signal processing for short-reach and long-haul applications
Optical Network Automation: AI/ML-based control, fault prediction, self-optimizing networks, and telemetry
Underwater Wireless Optical Communication: channel modeling (turbulence, scattering), link budget, and system design for blue-green wavelengths
Elastic Optical Networks: spectrum slicing, dynamic resource allocation, fragmentation management, and SDN-enabled control
Free-space optical (FSO) communications: atmospheric turbulence mitigation, acquisition/tracking, and hybrid RF/FSO systems

3. Structured Light and Optical Field Manipulation
Orbital Angular Momentum (OAM): generation, multiplexing, demultiplexing, and detection for high-capacity communications
Metasurface Wavefront Engineering: compact beam shaping devices, holographic metasurfaces, and programmable metasurfaces
Vector Beams and Polarization Control: spatially variant polarization, Poincaré sphere encoding, and applications in communication systems
Non-Diffracting Beams: Bessel, Airy, and Mathieu beams: propagation properties and beam recovery in free-space links
Propagation of Structured Light in Turbulent Media: adaptive compensation, turbulence-resistant encoding, and channel correction techniques
Plasmonic and dielectric nano-antennas for beam steering

4. Optical Sensing: Technologies and Applications
Distributed Fiber Optic Sensing: Brillouin, Raman, and Rayleigh scattering techniques for temperature, strain, and vibration monitoring
Fiber Bragg Grating (FBG) Sensors: design, multiplexing, and structural health monitoring
LiDAR Technologies: solid-state LiDAR, FMCW LiDAR, photon-counting LiDAR for autonomous driving and 3D mapping
Photonics Integrated Chip Sensors: on-chip optical sensors for chemical, biological, and physical quantities
Surface Plasmon Resonance (SPR) Sensors: real-time label-free detection, biosensing arrays, and portable platforms
Optical coherence tomography (OCT) and interferometric sensing

5. Machine Learning and AI in Communications
Deep Learning for Physical Layer: channel estimation, equalization, demodulation, and end-to-end learning for transceivers
Federated Learning for Edge Communications: privacy-preserving distributed training, model aggregation, and resource-aware learning
Graph Neural Networks for Network Routing: topology-aware optimization, flow scheduling, and adaptive routing
Generative AI for Network Management: traffic prediction, anomaly detection, and network digital twins
Autoencoder-Based End-to-End Communication: joint source-channel coding, learned modulation, and robust representations
Reinforcement learning for resource allocation: dynamic spectrum access, power control, and beam selection

6. Communication Signal Processing
Advanced Modulation and Coding: OFDM, FBMC, UFMC, LDPC, polar codes, and turbo equalization
Adaptive Filtering and Equalization: blind equalization, decision feedback equalizers, and Kalman filtering for time-varying channels
MIMO Signal Processing: precoding, detection algorithms (ZF, MMSE, sphere decoding), and massive MIMO reduced-complexity methods
Array Signal Processing: DOA estimation (MUSIC, ESPRIT, compressive sensing), beamforming (adaptive, robust), and source localization
Nonlinear Distortion Compensation: digital predistortion, memory polynomial models, and neural-network-based linearization
Signal Processing for Software-Defined Radio: reconfigurable filter banks, sample-rate conversion, and digital up/down conversion
Compressed Sensing and Sparse Recovery for channel estimation and spectrum sensing
Real-time DSP implementations on FPGA, GPU, and multi-core architectures

7. Electromagnetic Theory and Technologies
Computational Electromagnetics: FDTD, FEM, MoM, integral equation methods for antenna and scattering problems
RF/Microwave Circuits and Systems: LNA, mixer, VCO, power amplifiers, filters, and passive components (couplers, dividers)
Antenna Theory and Design: phased arrays, reflectarrays, lens antennas, MIMO antennas, and millimeter-wave antenna-in-package
Electromagnetic Compatibility and Interference (EMC/EMI): shielding, grounding, crosstalk mitigation, and system-level modeling
Metamaterials and Metasurfaces: negative-index materials, cloaking, perfect absorbers, and tunable electromagnetic surfaces
Millimeter-wave and Terahertz Electromagnetics: propagation, scattering, and material characterization
High-Power Electromagnetic (HPEM) Effects and protection techniques
Electromagnetic Inverse Problems for imaging and non-destructive testing

8. Advanced Microelectronic Systems and Components
Track Chair: Prof. Dr.T.Nandha Kumar, University of Nottingham Malaysia, Malaysia (Senior Member IEEE, Fellow HEA(UK), MIET)
RF MEMS and Tunable Components: switches, varactors, resonators, and phase shifters for reconfigurable front-ends
Monolithic Microwave Integrated Circuits (MMIC) for communication transceivers (GaN, GaAs, SiGe)
System-in-Package (SiP) and Heterogeneous Integration: 3D integration, interposers, and chiplet-based RF modules
High-Speed Mixed-Signal Circuits: data converters (ADC/DAC) for wideband communication, jitter analysis, and calibration
Power Amplifier Efficiency Enhancement Techniques: Doherty, envelope tracking, outphasing, and digital predistortion
Frequency Synthesizers and Clocking: PLLs, DDS, fractional-N synthesizers for mm-wave and sub-THz bands
Antenna-in-Package (AiP) and Module Design for 5G/6G terminals and base stations
Reliability and Thermal Management of microsystems for communication infrastructure

For details about topics, please visit: https://www.iecc.net/cfp.html


☛ PUBLICATION

Submitted papers will be strictly reviewed by the technical program committee. Accepted papers after successful registration and presentation will be included in Conference Proceedings, and submitted to be indexed by Ei Compendex and Scopus. The authors of the papers will be invited to participate in IECC to display their research results.

IECC has very credible publication and index records.

★ IECC2024 Conference Proceedings | ACM Digital Library | Ei Compendex and Scopus.
★ IECC2023 Conference Proceedings | ACM Digital Library | Ei Compendex and Scopus.
★ IECC2022 Conference Proceedings | ACM Digital Library | Ei Compendex and Scopus.
★ IECC2021 Conference Proceedings | ACM Digital Library | Ei Compendex and Scopus.
★ IECC2020 Conference Proceedings | ACM Digital Library | Ei Compendex and Scopus.
★ IECC2019 Conference Proceedings | ACM Digital Library | Ei Compendex and Scopus.


☛ SUBMISSION

1. Full Paper (Publication and Presentation). For full paper's template, please visit https://www.iecc.net/template.docx
2. Abstract (Presentation Only). For abstract's template, please visit https://www.iecc.net/Template-Abstract.doc

Submission System: https://www.zmeeting.org/submission/IECC2026

More details about submission, please visit: https://iecc.net/submission.html


☛ CONFERENCE SCHEDULE
December 11----Sign in and Collect Conference Materials
December 12----Welcome Message & Keynote Speeches & Parallel Sessions
December 13----Parallel Sessions


☛ CONTACT
Ms. Mary Zhan (Conference Secretary)
E-mail: iecc_conf@163.com