2026 6th International Conference on Advanced Materials and Mechatronics (ICAMM 2026) is scheduled to take place in Dalian, China from May 15-17, 2026.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/3yaayy

---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
● Mechanics of materials
● Optical/electronic/magnetic materials
● Advanced electromagnetism
● Laser Physics and Technology
● Study on high-speed signal interconnection and its physical mechanism
● Irradiation electronics
● Material forming process and equipment
● Semiconductor materials
● Electronic materials
● Micro/nanomaterials
● Smart Materials and Adaptive Structures
● Nanoelectronic Devices and Nanomanufacturing Technology
● New Energy Materials and Energy Storage Technology (e.g., lithium batteries, fuel cell materials)
● Composite Materials and Their Mechanical Properties
● Material Surface Modification and Thin Film Technology
● Mechatronic System Design and Integration Technology
● Sensor Technology and Microelectromechanical Systems (MEMS)
● High-Temperature Materials and High-Performance Structural Materials
● Metamaterials and Their Applications
● Multifunctional Materials and Devices
● Computational Materials Science and Materials Genome Engineering
● Brittle Fracture and Material Fatigue
● Quantum Materials and Quantum Devices

---𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Jinhui Song,Dalian University of Technology, China
Prof.Shahid Hussain,Jiangsu University, China
Prof. Fengming Du,Dalian University of Technology, China

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Journal of Physics: Conference Series (JPCS) (ISSN:1742-6596) Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: March 15, 2026
Registration Deadline: April 15, 2026
Final Paper Submission Date: May 3, 2026
Conference Dates: May 15-17, 2026

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the abstract or full paper(word+pdf) to Submission System:
https://ais.cn/u/3yaayy