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ICEIM 2026 : 2026 the 15th International Conference on Engineering and Innovative Materials (ICEIM 2026)

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Link: http://www.iceim.org/
 
When Aug 5, 2026 - Aug 7, 2026
Where Kyoto, Japan
Submission Deadline Mar 15, 2026
Categories    materials science   manufacturing   mechanical engineering   nanotechnology
 

Call For Papers

ICEIM 2026---SCOPUS Index

Full Name: 2026 the 15th International Conference on Engineering and Innovative Materials (ICEIM 2026)
Abbreviation: ICEIM 2026
Place: Kyoto, Japan
Date: August 5-7, 2026
Website: http://www.iceim.org/index.html

Co-sponsored by: Tokyo Denki University and Kyoto University of Advanced Science
Hosted by: Kyoto University of Advanced Science
Technically Co-sponsored by: Osaka Institute of Technology

2026 the 15th International Conference on Engineering and Innovative Materials (ICEIM 2026) will be held in Kyoto, Japan during August 5-7, 2026.

ICEIM 2026 will feature prestigious keynote speakers in the related areas, parallel sessions, and other technical programs, and aims to create an excellent forum to foster innovation, network with the brightest minds in academia and industry that are working in this field.
As an international academic forum where practitioners, researchers, and developers meet to learn and to exchange practical ideas and experiences, ICEIM 2026 sincerely invites you to submit your work in abstracts or full papers to the conference.

☛ CALL FOR PAPERS

Ⅰ.Materials Science and Engineering
Metallic alloys
Ceramics and glasses
Nanomaterials and technology
Composites
Polymers
Biomaterials
Functional materials
Metamaterials
Optical/Electronic/Magnetic materials
Smart/Intelligent materials & intelligent systems
Superconducting materials
Semiconductor materials
Microelectronic materials
Sensors and actuators
Coating and film
Micro-nano fluids
Materials for energy storage
Material chemistry
Advanced engineering materials
Material Physics
Condensed Matter Physics
Phase Transformations and Thermodynamics

Ⅱ.Materials Processing and Manufacturing
Casting
Welding, Sintering, Heat Treatment
Surface engineering/Coating
Material forming
Powder metallurgy
Surface treatment
Machining
Flexible manufacturing technology & system
Micro and nano-fabrication
Rapid prototyping
Additive manufacturing
Laser processing technology

Ⅲ.Material Simulation, Preparation and Characterization
Materials design
Advanced processing technology of materials
Analysis and characterization of materials interface & surface
New technologies and theories of materials characterization
X-ray phase analysis
Materials genome engineering
Materials simulation, computation, and design
Computational material science
Artificial intelligence technology in materials science and engineering
Metallography
Residual life analysis
Materials science and engineering databases

Ⅳ.Materials Properties, Measuring Methods and Applications
Ductility
Creep resistance
Electrical properties
Deformation and fracture mechanics
Stress-strain behaviour
Fatigue
Corrosion
Crack resistance
Magnetic properties
Wear resistance
Friction and wear
Non-destructive testing
Working properties of materials and structures

For details about topics, please visit http://www.iceim.org/call-for-papers.html


☛ PUBLICATION

✿ Conference Proceedings
1. Key Engineering Materials (ISSN print 1013-9826; ISSN cd 1662-9809; ISSN web 1662-9795)
Index:SCOPUS, REAXYS, Inspec, CAS, ProQuest, Google Scholar, etc.

2. Applied Mechanics and Materials (ISSN print 1660-9336, ISSN cd 2297-8941, ISSN web 1662-7482)
Index:Inspec, CAS, ProQuest, Google Scholar, etc.

☛ SUBMISSION

1. Full Paper (Publication and Presentation)
2. Abstract (Presentation Only)
3. Special Session

Please upload your full paper/abstract to
https://www.zmeeting.org/submission/iceim2026
Please submit proposal for special session to iceim_conf@vip.163.com .

For more information, please visit http://www.iceim.org/call-for-sessions.html .

☛ CONFERENCE SCHEDULE

August 5, 2026---Conference Registration and Materials Collection, Academic Visit

August 6, 2026---Keynotes & Breakout Sessions

August 7, 2026----Breakout Sessions


☛ CONTACT
Ms. Joy Wei (Conference Secretary)
E-mail: iceim_conf@vip.163.com

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