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BDAI 2026 : IEEE--2026 9th International Conference on Big Data and Artificial Intelligence (BDAI 2026)

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Link: http://www.bdai.net
 
When Jul 3, 2026 - Jul 5, 2026
Where Chongqing, China
Submission Deadline Feb 20, 2026
Categories    big data   computing   intelligent systems   information security
 

Call For Papers

Brief Information:
Full Name: IEEE--2026 9th International Conference on Big Data and Artificial Intelligence (BDAI 2026)
Abbreviation: BDAI 2026

July 3-5, 2026
Chongqing University of Science and Technology, Chongqing, China

Official Website: http://www.bdai.net


the 9th International Conference on Big Data and Artificial Intelligence (BDAI2026) will be held at Chongqing University of Science and Technology, Chongqing, China during July 3-5, 2026. The conference is sponsored by Chongqing University of Science and Technology, Chongqing, China, IEEE, Xi 'an Jiaotong-Liverpool University, Taicang, China; Co-sponsored by Ocean University of China, China Agricultural University and South China University of Technology.
The aim of BDAI2026 is to present the latest research and results of scientists related to Big Data and Artificial Intelligence topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field. We sincerely welcome the submissions all over the world.

All the registered and presented papers will be published in Conference Proceedings by IEEE; Conference contents will be submitted for inclusion into Ei Compendex and Scopus.

Conference History:
BDAI2025 was successfully held at Xi 'an Jiaotong-Liverpool University, Taicang, China during August 22-24, 2025. IEEE ISBN: 979-8-3503-9251-7
BDAI2024 was successfully held at North China University of Technology, Beijing during July 5-7, 2024! IEEE ISBN: 979-8-3503-5199-6
BDAI2023 was successfully held in Haining, Zhejiang, China during July 7-9, 2023! IEEE ISBN: 979-8-3503-0365-0
BDAI2022 was successfully held through virtual conference during July 8-10, 2022! IEEE ISBN: 978-1-6654-7080-3
BDAI2021 was successfully held through virtual conference during July 2-4, 2021! IEEE ISBN: 978-1-6654-1270-4
BDAI2020 was successfully held through virtual conference during July 3-6, 2020! ACM ISBN: 978-1-4503-7560-3
BDAI2019 was successfully held in Guangzhou, China during June 22-24, 2019! ACM ISBN: 978-1-4503-7185-8
BDAI2018 was successfully held in Beijing, China during June 22-24, 2018! IEEE ISBN: 978-1-5386-6136-9

Submissions Methods:
Much attention should be paid to write your paper according to the publication's request and submit the paper at: bdai2018@vip.163.com
or you could log in Easychair.ORG-BDAI2026 page to submit the paper (linkage presented in website)

BDAI2026 is eager to collaborate with the specialists and entrepreneurs in the related field, we are willing to provide any form of collaboration by this platform.
No matter you are an influencer in calling special sessions, or you are an excellent panel host, we are extremely pleased to listen to your inspiration and proposal.

any request please drop us a mail.



Conference Schedule:

July 3, 2026 10:00-16:00 Registration, collecting conference materials
July 4, 2026 09:00-12:00 Opening Remarks & Keynote Speeches
13:30-18:00 Oral & Poster Sessions
July 5, 2026 09:00-18:00 Visit / Tour (Pending)


Conference Venue: Chongqing University of Science and Technology


For any inquiry about the conference, please feel free to contact:

Ms. Ashley Liu

Email: bdai2018@vip.163.com

Telephone: +86-13980894300 (China)

WeChat: iconf-cs-2 (Please do leave BDAI2026 as the remarks.)

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