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EI/Scopus-ICMMP 2026 : 2026 International Conference on Metal Materials and Processing-EI/Scopus

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Link: https://ais.cn/u/AzMjmy
 
When May 15, 2026 - May 17, 2026
Where Changsha,China
Submission Deadline May 8, 2026
Final Version Due May 8, 2026
Categories    materials   metal materials   modeling   simulation
 

Call For Papers

2026 International Conference on Metal Materials and Processing (ICMMP 2026) will be held in Changsha, Hunan Province, China, from May 15 to 17, 2026, sponsored by Central South University and The Hong Kong Polytechnic University.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/AzMjmy

---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕ Metallic Materials
◕ Metal Processing
◕ Materials Characterization
◕ Metal Based Composites
◕ Surface Engineering for Metals
◕ Nano-structured Materials
◕ Modeling and Simulation of Materials
◕ Metals Application Including Biomedical Devices
◕ Energy Generation, Aerospace, and Processing, etc

---𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Chair Prof. Jianguo Lin,The Hong Kong Polytechnic University, China Hong Kong
Prof. Pesin Alexander,Nosov Magnitogorsk State Technical University, Russia
Prof. Shouxun Ji,Brunel University, Britain
Prof. Quentin Ramasse,University of Leeds, Britain
Prof. Mingxing Zhang,University of Queensland, Australia
Assoc. Prof. Zhenhai Xia,University of New South Wales, Australia
Assoc. Prof. Wentao Yan,National University of Singapore, Singapore
Prof. Heng Li,Northwestern Polytechnical University, China
Prof. Jufu Jiang,Harbin Institute of Technology, China
Prof. Cuie Wen,Royal Melbourne Institute of Technology, Australia

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in Journal of Physics: Conference Series (ISSN:1742-6596) and submit to EI Compendex and Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Registration Deadline: May 8, 2026
Final Paper Submission Date: May 8, 2026
Conference Dates: May 15-17, 2026

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/AzMjmy

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