Full name: 2025 International Conference on Advances in Materials Science and Engineering
Abbreviation: ICAMSE 2025
Website: www.icamse.site
Date: 17th-19th, 2025
Location: Tokyo, Japan


ICAMSE 2025 will be held in Tokyo, Japan from December 17th-19th, 2025. The conference is sponsored by Tokyo Denki University, University of Electronic Science and Technology of China, National Pingtung University of Science and Technology, American Society for Electrical Engineering and Universiti Teknologi Malaysia, and the aim of this conference is to bring together researchers and developers from both academia and industry to report on the latest scientific and theoretical advances, to discuss and debate major issues and to demonstrate state-of-the-art systems.


*Publication
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Accepted full papers will be published in the conference proceedings and submitted for Scopus/Ei Compendex index.


*TOPICS
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We target contributions from both academia and industrials on the following topics, but not limited to:

▪Nanomaterials and Nanotechnology
▪Advanced Materials for Energy Applications
▪Smart Materials and Structures
▪Biomaterials and Bioengineering
▪Material Processing and Manufacturing Technologies
▪Composite Materials
▪Corrosion and Surface Engineering
▪Computational Materials Science
▪Sustainable Materials and Green Technologies


*ICAMSE 2025 AWARDS
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▪Best Paper Award
▪Best Oral Presentation Award
▪Best Poster Presentation Award
▪Best Reviewer Award


*SUBMISSION
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1. Full Paper (Publication and Presentation)
2. Abstract (Presentation only)
Submission link: https://easychair.org/conferences/?conf=icamse2025


*IMPORTANT DATES
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▪Submission Deadline
September 30, 2025

▪Notification Date
October 20, 2025

▪Registration Deadline
November 10, 2025


*ORGANIZING COMMITTEE
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▪Conference Chairs
Hisaki Watari, Tokyo Denki University, Japan
Kazuo Umemura, Tokyo University of Science, Japan

▪Program Chairs
Yao Yan, University of Electronic Science and Technology of China, China
John Chia-Yen Lee, National Pingtung University of Science and Technology, Taiwan
Farid Abed, American University of Sharjah, United Arab Emirates

▪Program Co-chairs
Payam Shafigh, Wenzhou University of Technology, China
Elammaran Jayamani, Swinburne University of Technology Sarawak Campus, Malaysia

▪Publicity Chairs
Mohamed Hussien, Universiti Teknologi Malaysia, Malaysia
Li-Tsung Sheng, National Ilan University, Taiwan


*VENUE
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Tokyo University of Science, Japan
Kagurazaka campus, Building #13--Morito Memorial Hall
Address: 4-chōme-4-4 Kagurazaka, Shinjuku City, Tōkyō-to 162-0825


*CONTACT
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icamse_conf@163.com
website: www.icamse.site