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EI/Scopus-ICSET 2025 : 2025 2nd International Conference on Simulation and Electronic Technology-EI/Scopus

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Link: https://ais.cn/u/IRbiua
 
When Jul 4, 2025 - Jul 6, 2025
Where Hangzhou, China
Submission Deadline May 30, 2025
Final Version Due Jun 27, 2025
Categories    simulation   modeling   mechatronics   technology
 

Call For Papers

2025 2nd International Conference on Simulation and Electronic Technology (ICSET 2025) will be held in Hangzhou, China on July 4-6, 2025.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/IRbiua

---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
Track 1: Mechatronics and Simulation technology
Mechanical materials
Mechanical materials
Forming process and equipment dynamics simulation and analysis
Stress-strain simulation and analysis
Power electronics simulation
Structural optimization and topological optimization
Thermodynamic simulation and heat transfer analysis
Multi-scale and multi-physical field coupling simulation
Mechanical equipment analysis
Design and development

Track 2 : System modeling and Simulating
Multi-domain system modeling
Modeling and simulation of the control system
System identification and parameter estimation
Real-time simulation technology
Cyber-physical system
Robustness analysis and optimization
Digitalization and processing simulation

--- 𝗞𝗲𝘆𝗻𝗼𝘁𝗲 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Zike Zhang,Zhejiang University, China
Prof. Jiangping Hu,University of Electronic Science and Technology of China, China
Prof. Yufei Gao,Shandong University, China

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: May 30, 2025
Registration Deadline: July 3, 2025
Final Paper Submission Date: June 27, 2025
Conference Dates: July 4-6, 2025

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/IRbiua

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