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EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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Link: https://www.eurosime.org/
 
When Apr 6, 2025 - Apr 9, 2025
Where Utrecht
Submission Deadline Nov 4, 2024
Notification Due Dec 16, 2024
Final Version Due Feb 28, 2025
Categories    thermal   mechanical   multiphysics   micro/nano-electronics
 

Call For Papers

The 26th EuroSimE will be hosted in the city of Utrecht, Netherlands, on April 6-9, 2025. The historic city of Utrecht is centrally located in the Netherlands. The venue is easily accessible by train from Schiphol (Amsterdam) airport within 30 minutes. The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and
experiments of micro/nano-electronics and microsystems.
Professional training courses will be offered on April 6, 2025 followed by three days of technical sessions (April 7–9, 2025) comprising of oral and poster presentations. These session include Industry Keynote Talks given by Invited Speakers holding leading industrial positions to highlight major technological and industrial development trends, challenges, and roadmaps. In addition, Technical Keynote Talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In parallel, an exhibition of suppliers of experimental characterization equipment and simulation/optimization software will be hosted, demonstrating their latest features. Accepted papers will be submitted for inclusion in the IEEE Xplore digital library. The best papers will be selected for publication in Elsevier Microelectronics Reliability Journal and MDPI Micromachines Journal. Preselection of best papers candidates will
be based upon abstracts that are expected to clearly highlight scope, approach and major results of the proposed contributions. You can submit your paper on one of the following topics:

Single domain simulation
Material characterization and validation
Application domains
Multi-physics simulation
Emerging modeling methods and tools

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