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PlatCon 2024 : 2024 International Conference on Platform Technology and Service (PlatCon)

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Link: https://www.platcon.org
 
When Aug 26, 2024 - Aug 28, 2024
Where Jeju, Korea
Submission Deadline Jul 31, 2024
Notification Due Aug 4, 2024
Final Version Due Aug 9, 2024
Categories    computing platform   networking platform   smart human & media platform   convergence platform
 

Call For Papers

Call for Papers to PlatCon-24

2024 International Conference on Platform Technology and Service (PlatCon)
26 - 28 August 2024 Jeju, Korea
Hosted by ICRP Technically Co-sponsored by IEEE Busan Section


• Overview

PlatCon-24 will be the 10th event of the PlatCon conference series which is hosted and organized by the Institution of Creative Research Professionals (ICRP), and this year's event is technically cosponsored by IEEE Busan section (confirmed). This conference will be one of the most comprehensive conferences in the field of Platform Technology (PT). The main focus of PlatCon-24 is various PT research issues, but also its coverage can be extended to a wide spectrum of topics related to Computer Science and ICT platforms and their service domains. And PlatCon-24 would be a professional and informative forum for scientists, engineers, experts, professors, and students in the areas of Computer Science, Information Technology, Computing Technology, Communication & Network, HCI, Business & Management, Intelligent System, Cyber security, Industrial Security, Cyber Physical System, Education Technology, IT-based convergence research fields, and also in multidisciplinary or interdisciplinary research fields of them.

During the last decade, many countries have adopted in recent years roadmap for developing the future infrastructure in emerging platform technology areas such as automobile, big data processing technology, biotechnology, nanotechnology, grid computing and ICT (Information and Communication Technology). Our special interest lies in both theoretical and practical research contributions presenting new techniques, concepts, or analysis, reports on experiences and experiments of implementation and application of theories, and tutorials on new technologies and trends in various platforms/services areas and in all relevant scientific/engineering areas.

The PlatCon-24 is the next event, in a series of highly successful International Conference on Platform Technology and Service, previously held as PlatCon-23 (Busan, Korea, Aug. 2023), PlatCon-22 (Jeju, Korea, Aug. 2022), PlatCon-21 (Jeju, Korea, Aug. 2021), PlatCon-19 (Jeju, Korea, Jan. 2019), PlatCon-18 (Jeju, Korea, Jan. 2018), PlatCon-17 (Busan, Korea, Feb. 2017), PlatCon-16 (Jeju, Korea, Feb. 2016), PlatCon-15 (Jeju, Korea, Jan. 2015), and PlatCon-14 (Jeju, Korea, Feb. 2014).


• Conference Topics

Potential authors are invited to submit original, unpublished research articles, and on-going research papers, and also some invited articles, in all areas related to the platform technologies including, but not limited to, the following suggested topics:

PlatCon-24 covers all Computer Science and ICT areas with their convergence topics as below;

[ Computing Platform ]
- Computing theory
- Computer architecture
- Grid and cloud computing and systems
- Distributed and parallel computing systems
- Embedded computing and systems
- Fault-tolerant computing and systems
- Ubiquitous computing and systems
- Operation systems
- Secure OS and Trust OS

[ Networking Platform ]
- Ad hoc and sensor network platform
- Broadband communication platform
- Microwave communication platform
- Mobile and wireless platform
- Satellite communication platform
- Smart home and M2M (machine to machine) network
- System and network management and troubleshooting
- Vehicular communication platform
- Software defined network

[ Smart Human & Media Platform ]
- Game platform
- Interaction and HCI
- Media art convergence
- Multimedia platform
- Scientific and big data visualization platform
- Smart UI/UX platform
- Virtual and augmented reality
- E-Learning & U-Learning platform
- Web platform
- Artificial intelligence platform
- Automobile platform
- Big data platform
- Semantic web technology platform

[ Convergence Platform ]
- Business service platform
- Business management and intelligence
- Internet of things
- Service innovation and entrepreneurship
- Service oriented computing and applications
- Social networks
- Security and privacy issues in emerging platforms
- Convergence security
- Cyber security and digital forensics
- Smart grid and its security
- Financial platform


• Important Dates

- Paper Submission Due : Friday, 12 July, 2024
- Authors Notification : Friday, 19 July, 2024
- Camera-Ready Paper Friday, 26 July, 2024
- Author Registration Due : Friday, 26 July, 2024
- Conference Dates : Monday, 26 August - Wednesday, 28 August, 2024


• Paper Submission and Review

EDAS is the official conference tool for PlatCon-24.
Authors should submit their papers to the following EDAS system for review: https://edas.info/N32399
Further information about the paper submission, please visit https://www.platcon.org/cfp


• Publications

- Conference Proceedings : At least three reviewers of the International Technical Program Committee will carefully review each submitted paper. The accepted papers to the main conference “Track 1” and the official workshops will be included in the Conference Proceedings which will be distributed on the site and them submitted to the IEEE Xplore (No-show papers will be excluded in submission to IEEE Xplore). “Track 2” papers will not be included in the IEEE conference proceedings, but they will be presented at the conference and then published in PTL, Platform Technology Letters, which is an distinguished international journal published by ICRP and ICTPS.
- Conference Program Book : The Abstract Texts of the accepted papers will be included in the Conference Program Book and it will be distributed at the conference via online and also on the site.
- Some selected papers will be recommended for publication in the special issues of the following journals:
▶ https://www.mdpi.com/journal/electronics/special_issues/VU5OML9YEB
▶ https://www.mdpi.com/journal/sustainability/special_issues/5053YR0P17



• Contact Information

If you have enquiries about the conference, please contact the following conference chairs: Dongwann Kang (dongwann@seoultech.ac.kr) or Yanghoon Kim(kimyh7902@shinhan.ac.kr) or Young-Ae Jung (dr.claire.jung@gmail.com).

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