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IEEE INTERCON 2024 : XXXI International Conference on Electronics, Electrical Engineering and Computing

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Link: https://intercon.org.pe/
 
When Nov 6, 2024 - Nov 8, 2024
Where Lima, Peru
Submission Deadline Jun 2, 2024
Notification Due Sep 1, 2024
Final Version Due Sep 29, 2024
Categories    artificial intelligence   robotics   biomedical engineering   education
 

Call For Papers

We are excited to announce the IEEE INTERCON 2024, which will be held from 06th to 08th November in Universidad San Ignacio de Loyola (USIL), Lima - Peru.

IMPORTANT DATES:
Paper submission deadline: June 2nd, 2024
Notification of Acceptance: September 1st, 2024
Camera-ready: September 29th, 2024
Author registration deadline: October 6th, 2024

SUBMISSION GUIDELINES
The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore Digital Library. All papers, only in PDF file, must be submitted electronically through the EasyChair:
https://easychair.org/my/conference?conf=2024ieeeintercon

The format of the papers is based on IEEE conference template, which can be downloaded from:
https://www.ieee.org/conferences/publishing/templates.html

TOPICS OF INTEREST
Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:
T1. Artificial Intelligence and Machine learning
T2. Communications and Networking
T3. Power, Energy, and Power Electronics
T4. Biomedical Engineering and Healthcare Technologies
T5. Robotics, Control, Instrumentation, and Automation
T6. Multimedia Signal Processing and Analytics
T7. Devices, Circuits, and Materials
T8. RF Circuits, Systems, and Antennas
T9. Data Science and Computing Technologies
T10. Education in Engineering and Technology



ORGANIZING COMMITTEE
General Chair:
César A. Beltrán Castañón, IEEE Peru Section Chair

General Co-Chair:
Nils Murrugarra, University of Weber, USA

Finance Chair:
Jimmy Túllume Salazar, IEEE Peru Section Chair

Publication Chair:
Pedro Shiguihara, Universidad San Ignacio de Loyola, Peru
José Durán, IEEE Peru Section Chair

Local Organizers:
Javier Morán, Universidad San Ignacio de Loyola, Peru
Nain Ramos, Universidad San Ignacio de Loyola, Peru
Juan Salazar, Universidad San Ignacio de Loyola, Peru
Anghello Rodríguez, Universidad San Ignacio de Loyola, Peru

Conference Contact:
Marleni Delgado
administracion@ieee.org.pe

Advisory Committee:
Carlos Silva Cárdenas
Ernesto Cuadros Vargas
William Ipanaqué Alama
https://intercon.org.pe/

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