posted by user: FUN0524 || 1049 views || tracked by 1 users: [display]

SIES 2024 : 2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES 2024)

FacebookTwitterLinkedInGoogle


Conference Series : International Symposium on Industrial Embedded Systems
 
Link: https://ieee-sies.org/
 
When Oct 23, 2024 - Oct 25, 2024
Where Chengdu, China
Submission Deadline Jun 25, 2024
Categories    industrial engineering   systems engineering   mechanical engineering   embedded systems
 

Call For Papers

Full name: 2024 IEEE 14th International Symposium on Industrial Embedded Systems
Abbreviation:
Chengdu, China, October 23-25, 2024
Official Website: https://ieee-sies.org/


2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES 2024) will be held from 23 to 25 October in Chengdu, China. SIES 2024 is co-sponsored by IEEE and University of Electronic Science and Technology of China, China, technically sponsored by IEEE Future Networks, EMSIG, Virginia Tech, etc.
The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems and their applications in a variety of industrial environments.

* SIES 2024 accepted full papers will be included in IEEE Conference Proceedings, slected excellent proceedings papers will be recommended to SCI journals.

* Conference History
The SIES series were hosted by:
- University of Nice Sophia Antipolis, France (2006)
- Uninova, Portugal (2007)
- LIRMM/CNRS, France (2008)
- Ecole Polytechnique F d rale de Lausanne, Switzerland (2009)
- University of Trento, Italy (2010)
- Malardalen University, Sweden (2011)
- Karlsruhe Institute of Technology, Germany (2012)
- Polytechnic Institute of Porto, Portugal (2013)
- Scuola Superiore S. Anna, Italy (2014)
- Siegen University, Germany (2015)
- AGH UST, Poland (2016)
- France (2017)
- Graz University of Technology, Austria (2018)


*Conference Proceedings
All the accepted regular full papers will be included in IEEE Conference Proceedings and submitted for Ei Compendex & Scopus index.


*Submission
By EasyChair: https://easychair.org/my/conference?conf=sies2024


* Call for papers
Topics of interest include, but are not limited to:
- EMBEDDED SYSTEMS
- SYSTEM-ON-CHIP AND NETWORK-ON-CHIP DESIGN & TESTING
- NETWORKED EMBEDDED SYSTEMS AND EDGE COMPUTING
- EMBEDDED APPLICATIONS


* SIES Awards
- OUTSTANDING PAPER AWARD
- BEST REVIEWER AWARD
- BEST PAPER AWARD
- BEST WIP PAPER AWARD
- BEST PRESENTATION AWARD


* Venue:
Xiangyu Hotel (pending)
Address: No.10, North Renmin Road, Chengdu, China


* Contact:
Conference Secretary
Ms. Amy J.Y.Hu
Email: ieee-sies@academic.net
More information, please refer to: https://ieee-sies.org/

Related Resources

ICCAE 2025   IEEE--2025 17th International Conference on Computer and Automation Engineering (ICCAE 2025)
MEN 2024   7th International Conference on Mechanical Engineering
CCCIS 2025   IEEE--2025 5th International Conference on Computer Communication and Information Systems (CCCIS 2025)
JANT 2024   International Journal of Antennas
IEA/AIE 2025   The 37th International Conference on Industrial, Engineering & Other Applications of Applied Intelligent Systems
NLAI 2024   5th International Conference on NLP & Artificial Intelligence Techniques
CCGrid 2025   The 25th IEEE/ACM international Symposium on Cluster, Cloud and Internet Computing
IoTE 2024   5th International Conference on Internet of Things & Embedded Systems
IEEE CCCIS 2025   IEEE--2025 5th International Conference on Computer Communication and Information Systems (CCCIS 2025)
CIIS 2024   ACM--2024 7th International Conference on Computational Intelligence and Intelligent Systems (CIIS 2024)