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ICMSSM 2024 : The 9th International Conference on Mechanical Structures and Smart Materials


When Jun 15, 2024 - Jun 16, 2024
Where Beijing, China
Submission Deadline Jun 5, 2024

Call For Papers

Session Description

ICMSSM 2024 is the 9th edition in this series of conferences started in 2013 that are devoted to around the design and analysis of mechanical structures that incorporate smart materials. ICMSSM is a famous event worldwide that covers many dimensions of adaptive structural design, smart materials for intelligent sensing and monitoring systems, energy harvesting and storage, vibration control and damping, biomechanics.

Following the traditions of previous successful ICMSSM conferences held in Xiamen, China in 2013; Kuala Lumpur, Malaysia in 2014; Nanjing, China in 2016; Shenzhen, China in 2018; Xi'an, China in 2019; Ho Chi Minh City, Vietnam in 2020; Changsha, China in 2021; and most recently, a virtual gathering in Bangkok in 2023.

The paper publication

ICMSSM 2024 will produce electronic formal proceedings - with ISBN number, and to be indexed in the major bibliographical search engines. The ICMSSM formal proceedings will include: regular papers accepted as oral presentation, regular papers accepted as posters, papers for special sessions and workshops.
All accepted full papers will be published in IOP Conference Series: Journal of Physics (JPCS) and submitted for major indexing service like EI-Compendex, SCOPUS and etc.

Conference Theme

Topics of Interest for submission include, but are not limited to:
T1: Mechanical Science and Technology Advances
T2: Smart Structures and Systems
T3: Smart Materials and Surfaces
T4: Materials Manufacturing and Processing
T5: Methodology of Research and Analysis and Modeling

Keynote Speakers

Assoc. Prof. Ching Yern Chee, Universiti Malaya, Malaysia
Prof. Sinin bin Hamdan, Universiti Malaysia Sarawak, Malaysia
Prof. Yan Zhuge, UniSA STEM, University of South Australia, Australia
Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore
Prof. Daolun Chen, Toronto Metropolitan University, Canada
Prof. Alan Kin Tak, Technological and Higher Education Institute of Hong Kong
Prof. Zhili Dong, Nanyang Technological University, Singapore

Submission method

1. Submit by system:
2. Email:

Paper submission deadline: June 5, 2024

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