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ICICM 2024 : IEEE--2024 The 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)

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Link: http://icicm.net/
 
When Oct 25, 2024 - Oct 27, 2024
Where Wuhan, China
Submission Deadline Apr 30, 2024
Categories    energy   electronics engineering   systems engineering   electron devices
 

Call For Papers

★IEEE ICICM2024--Ei Compendex,Scopus--Wuhan, China★

★Full name: IEEE--2024 The 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)
★Abbreviation: ICICM 2024
**Place: Wuhan, China
**Time: October 25-27, 2024
**Website: http://icicm.net/

★Co-Sponsored by:
==Southeast University, China
==University of Electronic Science and Technology of China, China
==Wuhan University of Technology, China

==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
**Electronic submission system: https://easychair.org/conferences/?conf=icicm2024
**Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html

=Publication=
The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!

=Topics (include but not limit)=
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html

==Organizing Committee==
**Advisory Chair
Pui-in Mak, University of Macau, Macau, China
Ljiljana Trajkovic, Simon Fraser University, Canada

**Conference Chairs
Zhigong Wang, Southeast University, China
Chen Liu, Nanjing University of Posts and Telecommunica􀆟ons, China

**Conference Co-Chairs
Yufeng Guo, Nanjing University of Posts and Telecommunica􀆟ons, China
Letian Huang, University of Electronic Science and Technology of China, China

**Program Chairs
Zhikuang Cai, Nanjing University of Posts and Telecommunica􀆟ons, China
Junyong Deng, Xi'an University of Posts & Telecommunica􀆟ons

**Program Co-Chairs
Zhixiong Di, Southwest Jiaotong University, China
Delong Shang, Ins􀆟tute of Microelectronics of the Chinese Academy of Sciences, China
Abdel-Hamid Ali Soliman, Staffordshire University, UK
Alex Yakovlev, Newcastle University, UK

**Program Committee
Lu Zhu, Sun Yat-sen University, China
Youming Zhang, Southeast University, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Haizhi Song, University of Electronic Science and Technology of China,China
Hao Gao, Austria & Eindhoven University of Technology, The Netherland
Yun Fang, Silicon Austria Labs, Austria
Jeff Kilby, Auckland University of Technology, New Zealand

**Student Program Chairs
Shiheng Yang, University of Electronic Science and Technology of China, China
Chao Fan, Xi'an Jiaotong University, China

**Special Session Chairs
Chen Yang, Xi'an Jiaotong University, China
Jianshi Tang, Tsinghua University, China
Yuan Du, Nanjing University, China

**Academic Committee Chairs
Jin He, Peking University, China
Fanyi Meng, Tianjin University, China

**Academic Committee
Kailin Ren, Shanghai University, China
Yuanyuan Shi, University of Science and Technology of China, China
Minghui Li, University of Glasgow, UK
Wang Nan, Dalian University of Technology, China
Wu Gao, Northwestern Polytechnical University, China

**Publicity Chairs
Huizhen Qian, University of Electronic Science and Technology of China, China
Qiang Wu, Southwest Jiaotong University, China
Jia Wang, Northwestern Polytechnical University, China
Dengquan Li, Xidian University, China
Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand
Wei Ren, Xi’an University of Posts and Telecommunications, China

==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
ICICM2023 | Nanjing on October 20-23, 2023

=CONTACT US=
Ms. Jenny Chow
Email: icicm_conf@vip.163.com
Web: http://icicm.net/
Tel: (86)134-0855-5552

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