Please join researchers, engineers and scientists from around the world to share knowledge and experience in Polymeric Materials for Microelectronic & Photonic Applications (POLY), Adhesives in Electronics, and Polymeric Electronics Packaging (PEP). The program will include keynote, invited and contributed presentations, as well as panel discussions on, but not be limited to, the following topics:

--Materials: thermosetting/thermoplastic systems; adhesives (organic, inorganic, conductive);composites; molding compounds; fillers; underfills; pastes and films; optical; PCB materials; thick and thin films; low and high electric materials)

--Polymeric materials for harsh environments (military, automotive, avionic and aerospace, etc.);

--Processing and manufacturing: advanced packaging; lamination; printing; dispensing; spraying; transfer technologies; underfilling; potting; adhesion improvement; curing; low temperature processing; equipment; non-Si MEMS and MOEMS; costs;

--Reliability and testing in micro-electronic and photonic systems employing polymers: physics of failure; degradation mechanisms; adhesion; hermetisity; accelerated testing; nondestructive testing; predictive modeling;

--Polymers in opto-electronic, laser optics, and photonic devices and components;

--Plastic packages of IC devices;

--Fracture mechanics and moisture sensitivity of polymer materials;

--Physical design for reliability of micro- and opto-electronic devices containing polymers;

--Organic semiconductors for large-area electronics manufacturing;

--Nano-composites and nano-technologies with polymers;

--Organic displays;

--Polymers in portable information devices;

--Polymer-based consumer products;

--Unconventional and new applications of polymeric materials: polymer batteries, e-paper; flexible substrates;

--Environmental and safety issues.

DURATION AND CONTENT

Eight half-day tutorials (short courses) will be held on Sunday, August 17. Key-note presentations, invited talks, technical sessions and business-related panel discussions will be held on Monday through Wednesday, August 18-22. An IEEE Pavilion featuring technology exhibits and demonstrations will be open on August 18-22. A detailed agenda and further information can be found via the web at www.polytronic2008.com

ANTICIPATED ATTENDANCE

100-150 Participants. Register via the web at: www.polytronic2008.com/registration

CALL FOR PAPERS

POLYTRONIC 2008 is looking for technical paper contributions (initially, in the form of extended abstracts, and then in the form of full-length papers), coupled with tutorial, panel discussion, and demonstration (trade show type) proposals on the different aspects of the Portable Information Device engineering, including, but not limited to, the topics, standards, technologies and areas listed above.

Schedule for Abstract and Paper Submissions:

Deadline for Submission of Extended Abstract: February 8, 2008
Notification of Abstract Acceptance: March 8, 2008
Full-Length Paper Due: June 8, 2008
Notification of Full Paper Acceptance: July 8, 2008

Submit abstracts and papers via the web at www.polytronic2008.com/papers

CALL FOR TUTORIALS (SHORT COURSES)

Proposals for half day tutorials are also solicited based on the topics above or others related to issues and opportunities for the future of portable information communications, systems and applications. Tutorial presenters will receive compensation.

Submit tutorial proposals via the web at www.polytronic2008.com/tutorials

Schedule for Tutorial Proposals:

Acceptance notification deadline: April 8, 2008
Tutorial handouts/materials deadline: July 8, 2008
Registration deadline: July 22, 2008

CALL FOR TECHNOLOGY/BUSINESS APPLICATION PANELS

Proposals are also solicited for Technology / Business Application Panels in the topical areas above or others related to business and policy-related issues and opportunities for the portable information communications industry. Enquiries should be sent to Dr. Suhir, General Co-Chair and Technology/Business Application Panel Co-Chair, at suhire@aol.com. Additional information is available via the web at: www.polytronic.com

Panel proposal deadline: March 8, 2008
Panel acceptance notification deadline: April 8, 2008
Panel speaker confirmation deadline: July 8, 2008
Panel materials/hand out deadline: July 22, 2008
Registration deadline: August 8, 2008

CALL FOR DEMONSTRATIONS (EXHIBITS)

Submissions should be in the form of a proposal describing the main contributions of the demonstration and the merits of the proposed ideas. Authors should indicate if their demonstration presentation is a prototype or a poster. Proposals that demonstrate actual prototypes should include space, power and networking requirements. Submission details, including proposal templates, can be found on the conference web site at: www.polytronic2008.com.

Demonstration proposal submission deadline: April 8, 2008
Demonstration acceptance notification deadline: July 8, 2008
Final camera-ready two-page paper submission deadline: July 22, 2008
Registration deadline: August 8, 2008

COMMITTEE CHAIRS

General Co-Chairs:
Ephraim Suhir (University of California, USA)
Vinod Agrawala (US Navy Office of Naval Research Global (ONRG))
Bernd Michel (Fraunhofer Institute, Germany)

Administrative Co-Chairs:
William Yeager (USCG, USA)
Yi Zhang (UCSC, USA)

Technical Program Co-Chairs:
Chris Bailey (University of Greenwich, UK),
Kikuo Kishimoto (University of Tokyo, Japan)

Keynote/Panel Sessions Co-Chairs:
Ephraim Suhir (UCSC, USA),
Bernd Michel (Fraunhofer Institute, Germany),
Tadatomo Suga (University of Tokyo, Japan)

Tutorial (Short Course) Co-Chairs:
C.P. Wong (Georgia Tech, USA),
T. Suga (University of Tokyo, Japan)
Zsolt Illyefalvi-Vitez (Technical University, Budapest, Hungary)

Publicity Co-Chairs:
Kikuo Kishimoto (University of Tokyo, Japan),
Philippe Knauth (University de Provence, France),
Maria Luisa DiVona (University of Rome, Italy),
Fabrice Axisa (University of Ghent, Belgium),
Jan Felba (University of Wroclaw, Poland),
Zsolt Illyefalvi-Vitez (Technical University, Budapest, Hungary),
Johann Nicolics (Technical University, Vienna, Austria)

Publications Co-Chairs:
Ephraim Suhir (UCSC, USA),
Bernd Michel (Fraunhofer Institute, Germany),
Tadatomo Suga (University of Tokyo, Japan)

Exhibits/Demonstrations Co-Chairs:
Philippe Knauth (University de Provence, France),
Maria Luisa DiVona (University of Rome, Italy),
Fabrice Axisa (University of Ghent, Belgium),
Jan Felba (University of Wroclaw, Poland)

Webmaster:
William Yeager (USCG, USA)

Liaison with other IEEE and non-IEEE Organizations and Societies:
Ephraim Suhir (UCSC, USA)