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MOBISLICE 2023 : 6th Mobility Support in Slice-based network control for heterogeneous environments

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Link: https://mobislice.com
 
When Nov 7, 2023 - Nov 7, 2023
Where Dresden, Germany
Submission Deadline Sep 18, 2023
Notification Due Oct 3, 2023
Final Version Due Oct 9, 2023
Categories    networks   virtualization   mobility   5G
 

Call For Papers

CALL FOR PAPERS
MOBISLICE – 6th Mobility Support in Slice-based network control for heterogeneous environments

Network slicing has been standing as one of the key enabling technologies for the 5th Generation of Telecommunications. Alongside other important technologies, such as NFV, SDN and MEC, its contributions to isolated network provisioning in a more dynamic and flexible way are being pursued in different industry and academia arenas throughout the world. Nonetheless, considering the wide range of foreseen enhanced use cases (not only in scope of 5G but also Beyond-5G and 6G), slicing aspects have been mostly targeting either enhancements at the radio level, or the integration of novel cloud resourcing capabilities for supporting network operation at the core and/or the edge. As such, there is a wide gap related with the impact that such slicing-based procedures will exert over mobility management processes for seamless mobility support while the devices, network or services move both physically (i.e., change their network point of attachment) as well as virtually (i.e., between slices). MOBISLICE will address the evolutionary path that starts from existing deployed slice-mobility solutions (both still in research as well as in the wild) and will progress that analysis by assessing the technical considerations that are not yet feasible by 5G deployments, and must be progressed into Beyond-5G and 6G research. Here we will address to which degree 5G has gone beyond initial technological enablement for mobile slices, and paved the way for further capabilities, enhancements, use case scenarios and applications, whose scope goes into whole new levels and network evolutions.


Topics
The MOBISLICE workshop focuses, but is not limited to, the following topics targeting slicing:

- Vertical use cases and architectures evaluation
-- Slices in constrained environments (IoT, Edge, etc.)
-- Factories of the future use cases including manufacturing automation and process automation
-- Automotive service and ITS scenarios
-- Telco Operator and enterprise-based environments
-- Smart-X slice mobility
-- Reliability and security
-- Experimental, real trials and their impact in vertical performance

-Network, Computation and other enablers for MOBISLICE
-- Main operations and API
-- Inter- and intra-slice mobility procedures
-- Lifecycle management and impact
-- Heterogeneous access convergence or abstraction
-- High availability and reliability techniques
-- Experimental and real trials

- Standardization efforts and activities for MOBISLICE
-- Status and progresses in 3GPP/ETSI/IETF and other SDOs and vertical associations such as 5G-ACIA/5GAA
-- Proposals and standardization direction for advanced slicing
-- SDN/NFV initiatives
-- Slice-enhanced Networking and telecommunication protocols

- Beyond-5G and 6G slicing
-- Disruptive architectures
-- Zero-touch slice performance
-- Experimental and real trials
-- New scenarios


Technical Program Committee
Alex Galis (UCL)
Antonio de la Oliva (UC3M)
Billy Pinheiro (Amachains)
Carlos Bernardos (UC3M)
David Moura (CTEx)
Diego Lopez (Telefonica)
Dirk Trossen (InterDigital)
Fabio Berdi (UFSCar)
Fernando Farias (RNP)
Francesco Tusa (UCL)
Francisco Fontes (Altice Labs)
Gino Carrozzo (Nextworks)
Javier Baliosian (UdelaR)
Joan Serrat (UPC)
Juhoon Kim (Deutsche Telekom AG)
Kashif Mahmood (Telenor)
Marco Liebsch (NEC)
Pankaj Thorat (Samsung)
Paulo Ditarso Maciel (IFPB)
Ramon Casellas (CTTC)
Riccardo Trivisonno (Huawei)
Sung Won (Nokia)
Sri Gundavelli (Cisco)
Tarik Taleb (Aalto University)
Younghan Kim (Soongsil University)


Submissions
MOBISLICE will accept papers formatted as the standard IEEE double-column conference template, with a 6 page limit, allowing 1 additional page with an additional charge. The best paper voted by the TPC will receive A BEST PAPER award.
Improved versions of selected published papers will be invited for possible inclusion in Springer's "Journal of Internet Services and Applications (JISA) with Open Access, free of publication charge.
Check for more submission information at the workshop’s website: http://mobislice.com

Important Dates
Paper submission: 18th September, 2023
Notification of Acceptance: 3rd October, 2023
Camera-ready Submission: 9th October, 2023


Workshop Chairs
Prof. Dr. Daniel Corujo (University of Aveiro and Instituto de Telecomunicações, Portugal)
Prof. Dr. Augusto Neto (Federal University of Rio Grande do Norte, Brazil)
Dr. Seil Jeon (Telia Company, Sweden)

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