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HDIS 2023 : 5th International Conference on High Performance Big Data and Intelligent Systems

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Link: https://www.hdis.world/
 
When Dec 6, 2023 - Dec 8, 2023
Where Macau SAR, China
Submission Deadline Sep 30, 2023
Notification Due Oct 15, 2023
Final Version Due Nov 7, 2023
Categories    high performance computing   big data technology   intelligent technology
 

Call For Papers

The International Conference on High Performance Big Data and Intelligent Systems (HDIS, previously HPBD&IS) provides an effective platform for professionals, scientists, engineers, educators, students, and researchers worldwide to share and exchange their scientific ideas, views, innovations and experiences in the vast areas of High-Performance Computing, Big Data and Intelligence Systems with fellow researchers and participants. High-quality original submissions are welcome from research results and applications of all areas of High Performance Computing, Big Data and Intelligent Systems. All papers will be reviewed based on technical quality, relevance, originality, significance, and clarity. After a careful review process, all accepted papers will be published in the conference proceedings of HDIS 2023. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. Outstanding accepted papers will be invited to be extended and published in Special Issue of SCI-indexed journals, Ei-indexed journals and Chinese core journals.


Important Dates
– Full Paper Submission Deadline: Sep 30, 2023
– Notification of Acceptance: Oct 15, 2023
– Final Paper Submission Deadline: Nov 1, 2023
– Early Bird Registration Deadline: Nov 07, 2023


Call for Papers
Topics of interest include, but are not limited to:
1. High Performance Computing Technology and Its Applications
High Performance Computer Architecture
High Performance Computer System Software
High Performance Computing Environments
High Performance Micro Processor
High Performance Storage Technology
High Performance Ubiquitous Computing
High Performance Adaptive and Evolutionary Computing
High Performance Blockchain Technology
High Performance Application

2. Big Data Technology and Its Applications
Big Data Model
Big Data Processing Algorithm
Big Data Programming Technology
Big Data Learning and Analytics
Big Data Durability and Storage
Big Data Quality and Source Control
Big Data Protection Integrity and Privacy
Big Data Search and Mining
Big Data Management and Visualization
Big Data Applications

3. Intelligent Technology and Its Applications
Neural Network and Learning Systems
Cognitive computing Theory and Methods
Foundation Model and Large Complex Models
Incremental Learning and Continual Learning
Computer Vision
Point Cloud Data Processing
AI for Science
Robotic Science and Control Engineering
Intelligent Storage Device and System
Multimodality Information Fusion
Smart Medical Systems
Autonomous Driving and Smart Cockpit
Other AI-enabled Applications


Submission Guidelines
Please prepare your full paper according to the IEEE Templates (https://www.ieee.org/conferences/publishing/templates.html). All final submissions should be written in English. The full papers are limited to 8 pages, the short papers are limited to 5 pages, and the poster papers are limited to 2 pages. If the papers exceed requested pages, extra pages should be paid. All papers must be submitted electronically through the paper Submission System (https://easychair.org/conferences/?conf=hdis2023) in PDF format.
Each accepted paper requires at least one full registration. The submitted papers must not be previously published anywhere and must not be under consideration by any other conference or journal during the HDIS review process.


Organizing Committees
General Chairs
Xian-He Sun, Illinois Institute of Technology, USA
Geoffrey Fox, Indiana University, USA
Cheng-Zhong Xu, University of Macau, Macau SAR, China
Program Chairs
Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, China
Kejiang Ye, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, China
Panel Chair
Jiantao Zhou, University of Macau, Macau SAR, China
Poster Chair
Li Li, University of Macau, Macau SAR, China
Publication Chair
Minxian Xu, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, China
Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China
Local Chair
Ryan Leong Hou U, University of Macau, Macau SAR, China
Financial Chairs
Xi Zhang, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, China
Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China
Web Chair
Wenyan Chen, University of Macau, Macau SAR, China
Conference Secretary
Xi Zhang, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, China

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