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ICICDT 2023 : 20th International Conference on IC Design and Technology (ICICDT)


When Sep 27, 2023 - Sep 29, 2023
Where Tokyo, Japan
Submission Deadline Jun 30, 2023
Categories    semiconductor technology   semiconductor design   semiconductor applications

Call For Papers

2023 ICICDT is the twentieth edition (20th) in the series of the International Conference on IC Design and Technology, organized since 2004. 2023 ICICDT will be co-organized and held at the University of Tokyo, Tokyo, Japan from September 25-27, 2023.
Design and technology co-optimization (DTCO) plays a critical role in the era of big data with an explosion of new applications in the prominent fields of artificial intelligence (AI) and 5G. To meet the ever-growing demand for speed and power efficiency in data computing and transmission, separating design and technology, as is done in traditional integrated circuit (IC) engineering, encounters significant challenges. The ever-increasing complexity and variability require close interaction and collaboration for best optimization and trade-off by design, device, process and materials. Savvy IC engineers
also require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is, by design, a forum for engineers, researchers, graduate students, and professors, to cross the design-technology boundary by bringing design, technology, and process experts together. ICICDT has a unique format where each paper has a short presentation and a poster to encourage inquisitive discussions and the sharing of knowledge on a one-to-one basis during the poster session. This conference workshop style provides an excellent opportunity for all attendees to exchange breakthrough ideas and collaborate efficiently.

Scopes and Topics

The conference solicits papers describing original work in all topics relevant to semiconductor circuit, design, technology, and process, including but not limited to, in the following areas:

Advanced materials and processing technologies, power semiconductor technologies and circuits ;
Advanced packaging, lateral and vertical (2.5D and 3D) integration ;
Compound Semiconductor, 2D Materials ;
Digital circuits, low power memory devices and circuits ;
RF/analog, mixed-signal, ESD Protection devices and circuits ;
Design for manufacturing, yield, and test, System-on-Chip (SoC) and System-in-Package (SiP) design integration ;
System-on-Chip (SoC) and System-in-Package (SiP) design integration ;
Emerging technologies, circuits and applications (MEMS, Memory, Internet of Things, Autonomous cars, Machine Learning, Artificial Intelligence).

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