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VTCFall 2023 : Call For Papers IEEE VTC2023-FALL

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Link: https://events.vtsociety.org/vtc2023-fall/authors/call-for-papers-2/
 
When Sep 10, 2023 - Sep 17, 2023
Where HK
Submission Deadline TBD
Categories    computer science   communications   vehicle   networking
 

Call For Papers

VTC2023-Fall in Hong Kong will feature world-class technical sessions, workshops, and tutorials on, but not limited to, the following technical tracks. Prospective authors are invited to submit 5-page, original, and unpublished full papers. A full paper can be up to 7 pages in length, just note that papers longer than 5 pages will require the purchase of additional page charges at the time of registration and final paper submission. Please do not submit papers longer than 8 pages for review as it is not likely that the paper could be edited to a maximum of 7 pages or less upon acceptance.

1. Antenna Systems, Propagation, and RF Design
2. Electric Vehicles, Vehicular Electronics and Intelligent Transportation
3. Emerging Technologies, 5G and Beyond
4. IoV, IoT, M2M, Sensor Networks, and Ad-Hoc Networking
5. Machine Learning and AI for Communications
6. Positioning, Navigation, and Mobile Satellite Systems
7. Radio Access Technology and Heterogeneous Networks
8. Spectrum Management, Green Communications, Services and Security
9. Signal Transmission and Reception
10.Unmanned Aerial Vehicle Communications, Vehicular Networks, and Telematics
11.Wireless Networks: Protocols, Security and Services


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Paper submission deadline: 9 July 2023
Acceptance notification: 26 August 2023
Final paper submission deadline: 9 September 2023

Submission requirements: 5-page paper (without overlength charge) and up to 2 additional pages are allowed with the purchase of additional page charges in the amount of $100 USD per additional page at the time of registration and final paper submission.

Paper submission is open: https://vtc2023fall.trackchair.com/
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Organizing Committee:

General Co-Chairs
Khaled B. Letaief, Hong Kong University of Science and Technology, Hong Kong
Song Guo, The Hong Kong Polytechnic University, Hong Kong

Technical Program Chair
Xianbin Wang, Western University, Canada

Technical Program Vice-Chairs
Jianping Wang, City University of Hong Kong, Hong Kong
Dusit Niyato, Nanyang Technological University, Singapore

Publications Chair
James Irvine, University of Strathclyde, UK
Soumaya Cherkaoui, Polytechnique Montreal, Canada
Fiona Fang, Western University, Canada

Keynotes & Panels Co-Chairs
Nirwan Ansari, New Jersey Institute of Technology, USA
Lajos Hanzo, University of Southampton, UK

Tutorials Chair
Deze Zeng, China University of Geosciences (Wuhan), China
Peng Li, University of Aizu, Japn

Workshops Co-Chairs
Shui Yu, University of Technology Sydney, Australia
Keshav Sood, Deakin University, Canada

Industry Program Chair
Taimoor Abbas, InterDigital, Inc, USA

Publicity Chair
Kan Zheng, Ningbo University, China
Fulvio Babich, University of Trieste, Italy

Local Arrangements Chair
Zhenjiang Li, City University of Hong Kong, Hong Kong
Wenchao Xu, Hong Kong Polytechnic University, Hong Kong

Finance Chair
J. R. Cruz, The University of Oklahoma, USA

Conference Administrators
Rodney C. Keele, The University of Oklahoma, USA
Cerry Leffler, The University of Oklahoma, USA




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