SPICES 2023 : Workshop on Security and Privacy in Connected Embedded Systems
Call For Papers
SPICES 2023: Call for Papers
The 2nd Workshop on Security and Privacy in Connected Embedded Systems (SPICES 2023) -- https://www.tii.ae/workshop/spices
Co-located with EWSN 2023 -- September 25, 2023
Embedded systems have become pervasive in modern society: from managing the power grids that allow you to boil the kettle in the morning, to monitoring your sleep patterns at night. They play a crucial role in facilitating communication, enabling access to information, and powering the unseen minutiae of everyday life. Securing these networks and devices is of utmost importance to ensure the safety and privacy of individuals, businesses, and governments.
However, despite significant recent progress in recognising the need for security in such systems, it is often still an afterthought. Furthermore, emerging communication technologies such as 6G, cloud computing, and the inexorable rise of Artificial Intelligence and Machine Learning present new security threats and privacy issues that require innovative solutions. Moreover, unconventional threats and vulnerabilities can circumvent established security and privacy dogmas, thereby exposing key weaknesses in critical systems.
The Workshop on Security and Privacy in Connected Embedded Systems (SPICES) aims to address these challenges and foster interdisciplinary collaboration to explore innovative solutions for securing wireless and embedded systems. The workshop provides a platform for researchers, practitioners, and industry experts to discuss the latest topics and challenges in wireless and embedded systems security and privacy – not only on how existing systems should be secured, but exploring important security aspects (or lack of) in current research trends. We welcome submissions with unusual takes on existing techniques, proposals for novel security and privacy solutions, exposure of atypical weaknesses, and the application of unconventional approaches to solving next-generation wireless security challenges.
We invite researchers and practitioners from academia and industry to submit papers (up to 6 pages, double-column) focusing on topics such as:
- Wireless security for cyber-physical systems (e.g., factory automation).
- AI / Machine Learning assisted security and privacy, at the physical, MAC, or networking layers.
- Generative Adversarial Networks for wireless and embedded security.
- Security protocols for wireless communications and networking.
- RF Jamming attacks and defenses for wireless networks.
- Localization and positioning privacy (GPS, UWB, BLE 5.2, etc.).
- Measurement of embedded computing privacy leakage.
- Privacy enhancing and anonymization techniques in embedded computing.
- Security and privacy techniques in Embedded Computing.
- Side-channel attacks on IoT devices.
- Security and possible weaknesses in 6G cellular networks (3GPP, ETSI, IEEE, etc.).
- Testbed and experimental platforms for wireless security.
- Vehicular networks security (e.g., drones, automotive, avionics, autonomous driving).
- Security for UAV swarms (i.e., distributed, highly-mobile systems).
- Communications security in satellite systems.
- Cryptography primitives and lightweight protocols for embedded IoT devices.
- Reconfigurable Intelligent Surfaces (RIS).
- Physical Unclonable Functions (PUFs).
- Internet of the Things (IoT) security and privacy.
- Smart Contracts and Blockchain for wireless communication.
We especially encourage submissions that aim to broaden the discussion outside of traditional security and privacy challenges and approaches. Examples could include, but are not limited to:
- Bio-inspired security solutions.
- Visual/movement-based security solutions.
- Underwater communications security.
- Visual Light Communication (VLC)-based security.
- Quantum-based security.
Well reasoned arguments or preliminary evaluations are sufficient for this workshop.
*** Submission Instructions ***
Submitted papers must contain at most 6 pages (US letter, 9pt font size, double-column format, following the ACM master article template), including all figures, tables, and references. All submissions must be written in English and should contain the authors' names, affiliations, and contact information. Submissions may be uploaded through the SPICES workshop track under the EWSN 2023 EasyChair submission site (https://easychair.org/conferences/?conf=ewsn2023).
Accepted papers will be published in ACM as part of the EWSN 2023 proceedings. Authors of accepted papers are expected to present their work in a plenary session as part of the main workshop program.
*** Important Dates ***
Paper submission: May 31, 2023
Notification of acceptance: June 15, 2023
Camera-ready: June 30, 2023
Workshop day: September 25, 2023
*** Workshop Organizers ***
- Martin Andreoni (Technology Innovation Institute, UAE)
- Michael Baddeley (Technology Innovation Institute, UAE)
- Javier Berrocal (University of Extremadura, Spain)
- Gianluca Dini (University of Pisa, Italy)
- Pericle Perazzo (University of Pisa, Italy)