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INTERCON 2023 : XXX International Conference on Electronics, Electrical Engineering and Computing

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Link: https://intercon.org.pe
 
When Nov 2, 2023 - Nov 4, 2023
Where Lima, Perú
Submission Deadline Aug 15, 2023
Notification Due Sep 15, 2023
Final Version Due Oct 5, 2023
Categories    computer science   electronic   mechanic   bioengineering
 

Call For Papers

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CALL FOR PAPERS
INTERCON 2023 – XXX International Conference on Electronics, Electrical Engineering and Computing

November 02 - 04, 2023

UPC, Lima, Peru
http://intercon.org.pe
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IMPORTANT DATES
Paper submission (Extended): August 15, 2023
Notification: September 15, 2023
Camera-ready: October 05, 2023
Author registration deadline: October 12, 2023

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The XXX International Conference on Electronics, Electrical Engineering and Computing - INTERCON 2023 is a prestigious international technical conference organized by the IEEE Peru Section to bring together technological applications, knowledge, and understanding. INTERCON 2023 is the XXX version of the conference and is themed around the IEEE Future Directions platforms. The venue of the 2023 edition of INTERCON is UPC (Universidad de Ciencias Aplicadas) and its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 aims to continue the legacy of its predecessors by serving as a great platform for researchers to discuss and explore advanced technologies that can advance humanity.

TOPICS OF INTEREST
Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:

T1. Artificial Intelligence and Machine learning
T2. Communications and Networking
T3. Power, Energy, and Power Electronics
T4. Biomedical Engineering and Healthcare Technologies
T5. Robotics, Control, Instrumentation, and Automation
T6. Multimedia Signal Processing and Analytics
T7. Devices, Circuits, and Materials
T8. RF Circuits, Systems, and Antennas
T9. Data Science and Computing Technologies
T10. Education in Engineering and Technology

SUBMISSION GUIDELINES

The conference invites research papers of varying length from 6 to 8 pages (including abstract and references) and written in English. The format of the papers is based on IEEE conference template, which can be downloaded from:
https://www.ieee.org/conferences/publishing/templates.html

For all accepted papers, the authors will be asked to sign a copyright transfer on the contents of their paper(s). The accepted papers will be indexed and published on the IEEE Xplore Digital Library. All papers, only in PDF file, must be submitted electronically through the EasyChair:
https://easychair.org/conferences/?conf=2023ieeeintercon

ORGANIZING COMMITTEE

ADVISORY COMMITTEE
Carlos Silva Cardenas.
Ernesto Cuadros Vargas
William Ipanaqué Alama.

GENERAL CHAIR
César A. Beltrán Castañón

GENERAL CO-CHAIRS
Yván Tupac Valdivia

FINANCE CHAIR
Jimmy Túllume Salazar

PUBLICATION CHAIRS
Pedro Shiguihara
José Durán Talledo

LOCAL CO-CHAIR
Carlos Valdez (UPC, Peru)
Nikolai Vinces (UPC, Peru)
Yohanna Villanueva (UPC, Peru)

CONFERENCE CONTACT
Marleni Delgado (administracion@ieee.org.pe)

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