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AsiaJCIS 2023 : The 18th Asia Joint Conference on Information Security (AsiaJCIS 2023)


When Aug 15, 2023 - Aug 16, 2023
Where Japan
Submission Deadline May 8, 2023
Notification Due Jun 9, 2023
Final Version Due Jul 1, 2023
Categories    cryptography   information security

Call For Papers

The 18th Asia Joint Conference on Information Security (AsiaJCIS 2023) will be held in Japan (or virtual) on August 15 through 16, 2023. The focus of this conference is on the technical and practical aspects of security applications. The conference will serve as a forum to present new results from the academic research community and the industry. Original papers are solicited for submission to AsiaJCIS. In addition, several distinguished security experts will be invited to give technical talks.

Topics Areas of interest include, but are not limited to:
• Cryptography: Post Quantum Cryptography, Quantum Cryptography, Applied Cryptography, Cryptanalysis and Side Channel Attack, Blockchain and Smart Contract Security
• Network Security: Cloud Computing Security, NGN Security, Home Computing and Smart Home Security, Mobile Security, Ad-Hoc and Wireless Sensor Network Security, VANET Security, Wireless PAN/LAN/MAN/WAN Security, Peer-to-peer Computing Security, FW/IDS/IPS, DoS/DDoS Attack Countermeasures, Leak detection, 5G/6G mobile communication
• System Security: Computer/Application Security, Virtual machining Security, Database Security, Secure eHealth/eCommerce, Smart Contract, Ubiquitous Computing Security, Internet of Things (IoT)
• Application Security: Email Security, Web Services security, SNS Security, Mobile Security, IPTV Security
• Information Security: Management Human Resource Security, Big Data, Trusted Computing, Data breach, Intrusion detection, Phishing, Privacy breach
• Others: Smart Grid Security, Malware Countermeasures, Content Management, Biometrics, Usable Security and Privacy, Outsourcing Management

Important Dates
Paper Submission Deadline: April 24, 2023
Acceptance Notification: June 9, 2023
Camera-ready Due: July 1, 2023
Poster Submission Deadline: July 16, 2023
Conference Date: August 15-16, 2023

Submission Webpage

Instructions for Authors
• Authors are invited to submit original papers. The papers must not substantially duplicate work that any of the authors have published elsewhere or have submitted in parallel to any other conferences that have proceedings.
• Double-blind peer review is adopted in this conference. The submitted manuscripts must be anonymous, with no author names, affiliations, acknowledgements, or obvious references.
• Authors of accepted papers MUST give an oral presentation at the conference. Papers of authors who will not attend the conference will be deleted from the conference proceedings and announced as no-show papers on the conference site.
• The paper submission should conform to the following guidelines:
o The submission must be written in English and at most 8 pages in length, including references and appendices in the IEEE Xplore format for the conference. Extra payment is changed for more pages in full paper case.
o Formatted to US Letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings (print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text).
Please download the IEEE Template in Word version or Latex version. Authors should submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. Submissions ignoring these guidelines may be rejected without further consideration.

General co-chairs:
Yong Ding, Guilin University of Electronic Technology, China
Heung Youl Youm, Soonchunhyang University, Korea
Chun-I Fan, National Sun Yat-sen University, Taiwan
Koji Nakao, NICT, Japan

Program co-chairs:
Changsong Yang, Guilin University of Electronic Technology, China
Jun Lee, KISTI, Korea
Narn-Yih Lee, National Cheng Kung University, Taiwan
Rui Tanabe, Yokohama National University, Japan

Publication co-chairs
Yujue Wang, Hangzhou Innovation Institute, Beihang University, China
Huy Kang Kim, Korea University, Korea
Yu-Chi Chen, National Taipei University of Technology, Taiwan
Akira Yamada, Kobe University, Japan

Organizing committee chair:
Ryoichi Isawa, NICT, Japan

Contact for further information regarding to the conference, please send e-mail to asiajcis2023{#} . Please replace {#} with @.

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