CIMPS 2023 : 12th International Conference on Software Process Improvement
Call For Papers
We are pleased to invite the academic, government and business community to participate in the CIMPS’23 ( 12th International Conference on Software Process Improvement ), it will be held from 18 to 20 of October 2023. The Conference will take place in Tijuana, Baja California, México. The CIMPS is a global forum for researchers and practitioners that present and discuss the most recent innovations, trends, results, experiences and concerns in the several perspectives of Software Engineering with clear relationship but not limited to software processes, Security in Information and Communication Technology and Big Data Field (Submitted papers should follow the main themes proposed for the Conference (the topics proposed were not intended as restrictive)):
Organizational Models, Standards and Methodologies
Software Systems, Applications and Tools
Information and Communication Technologies
Processes in non-software domains (Mining, automotive, aerospace, business, health care, manufacturing, etc.) with a demonstrated relationship to software process challenges.
New trends and applications related to Software Engineering.
Three types of papers can be submitted in english or spanish language:
Full paper: Finished or consolidated R&D works. These papers will be assigned an 10/14-page limit.
Company or industrial paper: papers that show practical experience, R & D, tools, etc., focused on main topic of the conference. These papers will be assigned to a 6/8-page limit.
Poster paper: Ongoing works with relevant preliminary results, will be opened to discussion. These papers will be assigned a 4-page limit.
* Paper Submission: June 05, 2023
* Notification of acceptance: July 07, 2023
* Submission of accepted papers (Camera ready papers): July 24, 2023
* Payment of registration, to ensure the inclusion of an accepted paper in the conference proceeding: August 07, 2023
Publication and Indexing:
To ensure that a full, industrial and poster paper was published in the Conference Proceedings, at least one of the authors was fully registered by August 07, 2023, and the paper must have complied with the suggested layout and page-limit. Additionally, all recommended changes were addressed by the authors before they submitted the camera-ready version.
No more than one paper per registration was published in the Conference Proceedings, with a maximum of one additional paper per registration. An extra fee was paid for publication of additional paper.
All papers accepted in Spanish and posters-paper in Spanish and English language will be submitted for the inclusion into the IEEE Xplore Digital Library.
All Full and company or industrial paper accepted and registered in English Language will be published in Proceedings by Springer, will be submitted for indexation by ISI, EI-Compex, SCOPUS and DBLP, among other, and will be available in the SpringerLink Digital Library. Published by Springer in the Book series Lecture Notes in Networks and Systems.
The authors of the best selected papers in english and spanish will be invited to extend them for publication in international journals indexed by ISI/SCI, SCOPUS and/or DBLP, among others.
All papers will be subjected to a “double-blind review” by at least two members of the Program Committee.