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IJME 2023 : International Journal of Microelectronics Engineering


When N/A
Where N/A
Submission Deadline Sep 30, 2023
Notification Due Oct 23, 2023
Final Version Due Oct 27, 2023
Categories    electronics engineering   embedded systems   design   testing

Call For Papers

International Journal of Microelectronics Engineering (IJME)

Scope and Topics

International Journal of Microelectronics Engineering invites high quality manuscripts in the research areas of analog and digital circuit design methodologies. This journal provides a worldwide, regular and comprehensive update on microelectronics engineering. Journal invites significant research and application papers in all the areas listed below. The comprehensive review papers covering recent developments will also be considered.

Topics of interest include but are not limited to, the following

  • Semiconductor Devices and Modeling
  • Mixed-Domain Simulation and Design
  • Microelectronics and VLSI Circuits
  • Deposition/Growth, Photolithography/Patterning
  • Device Simulation and Modeling of VLSI/CMOS/Unconventional Devices
  • Emerging and Advanced Fabrication Methodologies
  • Logic, Architectural and System Level Synthesis
  • Area, Power and Thermal Evaluation
  • New Device Structures
  • Nonconventional Devices: OTFTs, CNTFETs, Multigate FETs Tunnel FETs
  • Display Technology
  • Organic and Molecular Flexible Electronics
  • Embedded Systems
  • Emerging Devices and Circuits
  • Design of Semiconductor Memories
  • System on Chip Design
  • Testing, Design for Testability
  • Low Power VLSI Design
  • Quantum Computing and Nano-Technology
  • Micro Sensors and MEMS
  • Beyond CMOS Devices

Paper Submission

Authors are invited to submit papers for this journal through E-mail Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates

Submission Deadline:September 30, 2023
Authors Notification: October 23, 2023
Final Manuscript Due: October 27, 2023
Publication Date:Determined by the Editor-in-Chief


Editor in Chief

Editorial Board Members

... More

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  • Ahmad Ihsan Mohd Yassin, Universiti Teknologi Mara, Malaysia
  • Deepak B.B.V.L, National Institute of Technology, India
  • Bozidar Sarler, University of Nova Gorica & Institute of Metals and Technology‏, Slovenia
  • Byungtae Lee, KAIST Venture Investment Holdings, South Korea‏
  • Chandrashekhar Badgujar, Mumbai University‏, India
  • Emeka E. Okwueze Fnip, University of Calabar, Calabar - Nigeria
  • Ged Griffin, University of Melbourne, Australia
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