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TTSDP 2023 : 15th International Workshop on Tools and Techniques in Software Development Process

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Link: https://sites.google.com/site/tandtinsdp/home
 
When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Apr 20, 2023
Notification Due Apr 30, 2023
Final Version Due May 12, 2023
Categories    software industry   industrial applications   software techniques   software tools
 

Call For Papers

TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process

The conference is planned to be organized in Blended form (physical presentation and online presentations). 15th International Workshop on "Tools and Techniques in Software Development Process" in conjunction with The 2023 International Conference on Computational Science and Its Applications (ICCSA 2023). It will be held
during July 3 - 6, 2023, in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece.

https://sites.google.com/site/tandtinsdp/home

Accepted papers will be published in Lecture Notes in Computer Science by Springer.

The extended version of all presented papers will also be invited for publication in
International Scientific Journals(All indexed in SCOPUS/Web of Science/ECIE).
https://www.mdpi.com/topics/Software_Engineering_Applications

Submission deadline: April 20, 2023 

About the Workshop and Topics

The Tools and Techniques in Software Development Processes (TTSDP 2023) provide a forum for researchers, and practitioners to share their new achievements, tools, and techniques in the field of the software development process. TTSDP especially invites experience papers from industry and academia, short papers, reports, surveys, working papers/work in progress, and industrial reports. Review/Comment papers are also welcome with the limitation that the paper should be on a general problem/topic in the field (no comments are allowed on a particular paper). TTSDP covers all the aspects of the development process: process models, agile development, software engineering practices, requirements, system, and design engineering, including architectural design, software modeling, testing strategies and tactics, process and product metrics for each phase of software development, component-based software engineering, software quality, verification, validation techniques, and software project management.

TTSDP 2023 invites you to submit your work that describes original and significant contributions in all areas of the software development process. The paper submitted to TTSDP 2023 must not submit elsewhere, either in a conference or journal, and should be in IEEE style. Papers selected after peer review will be included in the conference proceedings and presented virtually at the conference.

TTSDP 2023 invites you to submit three different types of session papers (8 to 18 pages long) on all the above-mentioned topics:

Research papers((12-18 pages in LNCS Format)): Papers that describe original and significant contributions in all areas of the software development process.

Experience paper (8-11 pages in LNCS Format): papers from the field describing real-world experience related to the software development process.

Short paper and reports(8-11 pages in LNCS Format): Papers that allow the explanation of ideas that are not yet fully validated. Review articles (not on a particular paper), comparative studies, and survey reports are welcome.

The paper submitted to TTSDP 2023 must not have been submitted elsewhere, either in a conference or journal, and must be in LNCS style. Papers selected after review will be included in the conference proceedings and presented orally at the conference.

Publication

All accepted workshop (TTSDP) papers will be included in the proceeding of ICCSA 2023, published by Springer. One of the authors of the accepted paper is required to register and is expected to present the paper at the conference. Extended and modified versions of all accepted papers are invited to publish in various journals
(all Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE indexed Journal.

Submission site: http://ess.iccsa.org/cgi-bin/login.py

IMP: While submitting to the conference site, please select the track of your submission, "15th International Workshop on Tools and Techniques in
Software Development Processes (TTSDP 2023)".

Proceedings Format: Please follow the Springer LNCS proceedings guidelines for preparing your paper.
https://www.springer.com/gp/computer-science/lncs/conference-proceedings-guidelines

Special ISSUES:

The accepted papers of TTSDP 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023).
https://www.mdpi.com/topics/Software_Engineering_Applications.


Important Dates


April 20, 2023: Deadline for abstract and paper submission
April 30, 2023: Notification of Acceptance
May 12, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline)
May 12, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece

Organizing Chair

Sanjay Misra
Institute of Energy Technology, Halden, Norway
ssopam@gmail.com


Program Chair

Lov Kumar
National Institute of Technology, Kurukshetra, India
lovkumar@nitkkr.ac.in

Rytis Maskeliunas
Kaunas University of Technology, Lithuania
rytis.Maskeliunas@ktu.lt

International Programme Committee Members

Raj Kumar Buyya, University of Melbourne, Australia
Mario Fusani, National Research Council of Italy
Daniel Rodríguez, University of Alcalá, Spain
Robertas Damasevicius, Kaunas University of Technology, Lithuania
Reda Alhajj, University of Calgary, Canada
Emilia Mendes, Blekinge Institute of Technology, Sweden
Vahid Garousi, Queen's University Belfast, UK
Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile
Michel dos Santos Soares, Federal University of Sergipe, Brazil
V. B. Singh, JNU, Delhi, India
José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico
Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile
Eduardo Guerra, National Institute of space research, Sao Jose, Brazil
Murat Koyuncu, Atilim University, Turkey
Rytis Maskeliunas, Kaunas University of Technology, Lithuania
Tolga Pustali, Cankaya University, Turkey
Matthew O. Adigun, University of Zululand, South Africa
Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain
Ibrahim Akman, Atilim University, Ankara, Turkey
Marco Crasso, UNICEN University, Argentina
Markus Holopainen, University of Helsinki, Finland
Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan
Cristian Mateos, UNICEN University, Argentina
Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam
Alejandro Zunino, UNICEN University, Argentina
Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil
Ravin Ahuja, University Of Delhi, India
Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India
Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia
Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea
Adewole Adewumi, Algonquin College, Canada
Matthew Adigun, University of Zululand, South Africa
Luis Fernandez Sanz, Universidad de Alcala, Spain
Ayush Dogra, CSIR-CSIO, Chandigarh, India
Ayan Chatterjee, Simula Research Laboratory, Norway
Hasan Ogul, Østfold University, Halden, Norway

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