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SEPA 2023 : 15th International Symposium Software Engineering Processes and Applications

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Link: https://sites.google.com/view/ssepa/home
 
When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Apr 20, 2023
Notification Due Apr 30, 2023
Final Version Due May 12, 2023
Categories    software applications   artificial intelligence   advanced applications   software engineering
 

Call For Papers

SEPA 2023: 15th International Symposium on Software Engineering Processes and Applications
Publisher- Springer LNCS, Special issues- in Several SCIE/SCOPUS Indexed Journal

The conference is planned to be organized in Blended form (physical presentation and online presentations).

The accepted papers will be published in Lecture Notes in Computer Science by Springer 
https://sites.google.com/view/ssepa/home
http://www.iccsa.org/workshops 

Following the grand success of SEPA 2022(Malaga, Spain), SEPA 2021(BLENDED MODE) and SEPA 2020(Online), SEPA 2019 (in Saint Petersburg, Russia), SEPA 2018(In Melbourne, Australia), SEPA 2017(in Trieste, Italy), SEPA 2016 (in Beijing, China), SEPA 2015 (in Banff, Canada), SEPA 2014 (in Guimaraes, Portugal), SEPA 2013 (in Ho Chi Ming, Vietnam), SEPA 2012 (in Salvador, Brazil), SEPA 2011 (in Santander, Spain), SEPA 2010 (in Fukuoka, Japan), SEPA 2009 (in Sowon, Korea), SEPA 2022 (in conjunction with ICCSA 2022) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece.

Submission deadline: April 20, 2023 

About the Workshop and Topics 

Software Engineering Processes and Applications (SEPA: 2023) is aimed to provide a forum to scientists/researchers/engineers/practitioners and academicians to share their ideas, experiences, and research in the field of software engineering (AI/ML) and its applications in various domains. SEPA 2023 covers all the frontier issues and trends in the modern software engineering process and development in various application areas through various emerging tools using AI and ML. It includes process models, the development processes for different software platforms (e.g., social networks, cloud), a process for adaptive, dependable, embedded systems, agile development, software engineering practices, requirements, system, and design engineering including architectural design, component-level design, formal methods, software modeling, testing strategies and tactics, process and product metrics, Web Engineering, project management, risk management, and configuration management. SEPA also invites papers for the development process of the software/software systems in application areas (e.g. agriculture, aviation industry, business, cyber-crime, education, government, military, etc.) by utilizing modern software engineering tools (AI/ML and various computational techniques).  

SEPA invites you to submit theme papers that describe original and significant contributions in all the above-mentioned areas of software engineering and its applications. The paper submitted to SEPA 2023 must not be submitted elsewhere, either in a conference or journal, and should be 12 - 16 pages (LNCS style). Papers selected after peer review will be included in the Lecture Notes in Computer Science published by Springer (only after completing the registration)
and presented online.  

Publication 

All contributions will be reviewed by international program committee members and judged on their quality and relevance. The accepted papers for SEPA 2023 will be published in Lecture Notes in Computer Science as a book series of Computational Science and Its Applications: ICCSA. Please note that one of the authors of the accepted
paper should be registered and supposed to present the paper at the conference (virtual presentation is allowed for authors who cannot attend the conference). The extended version of selected papers will also be invited for publication in several journals (All Web of Science and SCOPUS-indexed journals), including the best papers
in SCIE-indexed journals*. 

*Special issues In SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023).
https://www.mdpi.com/topics/Software_Engineering_Applications

Submission 

Please submit your paper through ICCSA 2023 conference website. 
Submission site: http://ess.iccsa.org/cgi-bin/login.py 

while submitting to the conference site, please select the track of your submission, "15th International Symposium on Software Engineering Processes and Applications (SEPA 2023)". 

Important Dates:
April 20, 2023: Deadline for abstract and paper submission
April 30, 2023: Notification of Acceptance
May 12, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline)
May 12, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece

International Program Committee 

Organizing Chair (Contact) 

Sanjay Misra 
Department of Computer Science and Communication
Østfold University College, Halden, Norway
ssopam@gmail.com

Programme Committee Chair 

Robertas Damasevicius 
Department of Software Engineering
Kaunas University of Technology, Kaunas, Lithuania
robertas.damasevicius@ktu.lt


International Programme Committee Members 

Raj Kumar Buyya, University of Melbourne, Australia
Mario Fusani, National Research Council of Italy
Daniel Rodríguez, University of Alcalá, Spain
Robertas Damasevicius, Kaunas University of Technology, Lithuania
Reda Alhajj, University of Calgary, Canada
Emilia Mendes, Blekinge Institute of Technology, Sweden
Vahid Garousi, Queen's University Belfast, UK
Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile
Michel dos Santos Soares, Federal University of Sergipe, Brazil
V. B. Singh, JNU, Delhi, India
José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico
Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile
Eduardo Guerra, National Institute of space research, Sao Jose, Brazil
Murat Koyuncu, Atilim University, Turkey
Rytis Maskeliunas, Kaunas University of Technology, Lithuania
Tolga Pustali, Cankaya University, Turkey
Matthew O. Adigun, University of Zululand, South Africa
Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain
Ibrahim Akman, Atilim University, Ankara, Turkey
Marco Crasso, UNICEN University, Argentina
Markus Holopainen, University of Helsinki, Finland
Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan
Cristian Mateos, UNICEN University, Argentina
Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam
Alejandro Zunino, UNICEN University, Argentina
Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil
Ravin Ahuja, University Of Delhi, India
Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India
Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia
Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea
Adewole Adewumi, Algonquin College, Canada
Matthew Adigun, University of Zululand, South Africa
Luis Fernandez Sanz, Universidad de Alcala, Spain
Ayush Dogra, CSIR-CSIO, Chandigarh, India
Ayan Chatterjee, Simula Research Laboratory, Norway
Hasan Ogul, Østfold University, Halden, Norway
Georgios Lampropoulos, International Hellenic University, Greece

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