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IEEE MASS 2023 : IEEE MASS 2023 -- IEEE International Conference on Mobile Ad- Hoc and Smart Systems


When Sep 25, 2023 - Sep 27, 2023
Where Toronto, Canada
Submission Deadline Apr 10, 2023
Notification Due Jun 26, 2023
Categories    communications   networking

Call For Papers

The 20th IEEE International Conference on Mobile Ad-Hoc and Smart Systems (MASS 2023), Toronto, Canada, September 25 - 27, 2023

Sponsored by the IEEE Computer Society and IEEE Computer Society's TCDP, the 20th edition of the IEEE International Conference on Mobile Ad-Hoc and Smart Systems (MASS) will be held in Toronto, Canada in September 2023, and it aims at bringing together researchers, developers, and practitioners to address recent advances in mobile ad-hoc and smart systems, covering algorithms, theory, protocols, systems & applications, experimental evaluations and testbeds, security/privacy, as well as AI/ML-based smart design. We are pleased to invite you to submit original contributions to IEEE MASS 2023. All original, unpublished contributions are solicited in all aspects of mobile ad hoc networks (MANETs) and smart systems, from mobile networking/computing to cyber-physical systems to Internet of Things, from theory to systems and applications. All submissions will be peer-reviewed based on relevance, originality, importance and clarity. Topics of interest include, but are not limited to:

* 5G networks and technologies
* AI/ML for smart wireless networks
* AI and machine learning aided protocol design and resource allocation
* AI and machine learning based applications for ad hoc networks
* Algorithms for MANETs and WSNs
* Application Layer Protocols
* Clustering, topology control, coverage, and connectivity
* Cognitive networking
* Cooperative and cognitive communication
* Cooperative sensing, compressive sensing, sensing from communications
* Cloud, crowd-sourced, participatory and (mobile) social sensing
* Cyber-physical systems and applications
* Data gathering, fusion, and dissemination
* Energy-efficient architectures, algorithms, and protocols
* Experiences in real-world applications and deployments
* Flying Ad-Hoc Networks
* Free-space optical networks
* Heterogeneous networks
* Internet of Things (IoT) devices, gateways, and infrastructure
* Light-weight distributed machine learning
* Localization and Location Based Services
* Measurements, experimental systems and test-beds
* Mobile computing and networking
* mmWave and Terahertz networks
* Mobility modeling and management
* Multi-channel, multi-radio and MIMO technologies
* Network components, operating systems, and middleware
* Opportunistic networking, delay tolerant networking
* QoS and Resource management
* Robotic networks
* Routing protocols
* Scalability, stability, and robustness of networks and sensor systems
* Security and privacy at all layers, including the physical layer
* Sensor enabled drone, UAV, UUV systems
* Smart grid, healthcare, transportation applications
* Vehicular networks and protocols
* Visible light communications
* Wearable and human-centric devices and networks

All submissions will be peer-reviewed on the basis of relevance, originality, importance, and clarity.

*Submissions Guidelines and Proceedings*

Authors are invited to submit original, unpublished research papers that are not currently under review elsewhere. All submissions should be written in English with a maximum length of 9 single-spaced, double-column pages using 10pt fonts on 8.5 in x 11 in paper, including all figures, tables, and references, in PDF format. Authors must use the Manuscript Templates for IEEE Conference Proceedings. Accepted papers will appear in the conference proceedings published by IEEE and will be presented at the conference. Based on TPC reviews and discussions, some papers may be accepted as 5-page short papers or 2-page posters in addition to the regular 9-page papers. For all papers, IEEE reserves the right to exclude the paper from distribution after the conference (e.g., removal from IEEE Xplore) if the paper is not presented at the conference. Note that the conference will also include a poster and demo session. Submission Site:

*Important Dates*

Paper submission due: Monday, April 10, 2023
Acceptance notification: Monday, June 26, 2023
Camera-ready version: Monday, July 17, 2023
Conference date: September 25-27, 2023

*General Co-Chairs*
J.J. Garcia-Luna-Aceves, University of California, Santa Cruz, USA
Guoliang Xing, the Chinese University of Hong Kong, China

*Program Co-Chairs*
Yu Wang, Temple University, USA
Eyuphan Bulut, Virginia Commonwealth University, USA

*Track Chairs*

*Algorithms and Theory
Weifa Liang, City University of Hong Kong, China
Yingshu Li, Georgia State University, USA

*Artificial Intelligence/Machine Learning-based Smart Design
Tamer Nadeem, Virginia Commonwealth University, USA
Bin Li, Pennsylvania State University, USA

*Protocols and Emerging Technologies
Karl Anderson, Luleå University of Technology, Sweden
Fan Li, Beijing Institute of Technology, China

*Security and Privacy
Muhammad Shahzad, North Carolina State University, USA
Yan Wang, Temple University, USA

*Systems and Applications
Kate Lin, National Chiao Tung University, Taiwan
Tao Han, New Jersey Institute of Technology, USA

*Workshop Co-Chairs
Eirini Eleni Tsiropoulou, University of New Mexico, USA
Nils Aschenbruck, Osnabrück University, Germany

*Poster & Demo Chair
Zhichao Cao, Michigan State University, USA

*Local Arrangements Chair
Wenbo He, McMaster University, Canada

*Publication Chair
Dajin Wang, Montclair State University, USA

*Publicity Co-Chairs
Marcelo Carvalho, University of Brasília, Brazil
Xiangmao Chang, Nanjing University of Aeronautics and Astronautics, China
Shiwei Fang, University of Massachusetts Amherst, USA
Qun Song, Delft University of Technology, Netherlands

*Web Co-Chairs
A B M Mohaimenur (Bivor) Rahman, UNC Charlotte, USA
Xinliang Wei, Temple University, USA

*Registration & Finance Chair
Shuhui Yang, Purdue University Northwest, USA

*Steering Committee
Jie Wu (chair), Temple University, USA
Elizabeth Belding, UC Santa Barbara, USA
Falko Dressler, Technical University of Berlin, Germany
J. J. Garcia-Luna-Aceves, UC Santa Cruz, USA
Kang G. Shin, University of Michigan, USA

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