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IEEE ICICM 2023 : IEEE--2023 The 8th International Conference on Integrated Circuits and Microsystems (ICICM 2023) | |||||||||||
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Call For Papers | |||||||||||
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【IEEE Official List Event--ICICM 2023】
★ICICM2023--IEEE|Ei Compendex,Scopus--Nanjing, China★ ★Full name: 2023 The 8th International Conference on Integrated Circuits and Microsystems ★Abbreviation: ICICM 2023 **Place: Nanjing, China **Time: October 20-23, 2023 **Website: http://icicm.net/ ★Co-Sponsored by: ==Southeast University, China ==University of Electronic Science and Technology of China, China ==Nanjing University of Posts and Telecommunications, China ==IEEE ==CAS ==Submission== 1. Full paper (publication and presentation) 2. Abstract (presentation only) Electronic submission system: https://easychair.org/conferences/?conf=icicm2023 Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html =Publication= The accepted and registered papers will be publication in IEEE Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc. ***ICICM2016-2022 has been successfully indexed by EI Compendex and Scopus already! ***ICICM2023 has been listed in IEEE Offcial Event List. =Topics (include but not limit)= ► Thz and Microwave MicroSystem ► Devices and Circuits for Wirless System ► Application Specific Circuits and Systems for Communication ► Digital, Analog, Mixed Signal IC and SOC design technology ► Silicon integrated circuits and manufacturing ► Low-power, RF devices & circuits ► IC Computer-Aided –Design technology, DFM ► Silicon/germanium devices and device physics ► Interconnect, Low K, High K and other process technologies ► Unconventional and nano-electronics ► Organic semiconductor devices and technologies ► Compound semiconductor devices and circuits ► Displays, sensors and MEMS ► Semiconductor materials and material characterization ► Packaging and testing technology ► Solar cell & other devices for new energy sources ► Modeling and simulation ► Equipment technology ► Reliability ► Displays, sensors and MEMS ► Advance memories technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== **Advisory Chair Pui-in Mak, University of Macau, Macau, China Ljiljana Trajkovic, Simon Fraser University, Canada **Conference Chairs Zhigong Wang, Southeast University, China Chen Liu, Nanjing University of Posts and Telecommunicaons, China Li Qiang, University of Electronic Science and Technology of China, China **Conference Co-Chairs Yufeng Guo, Nanjing University of Posts and Telecommunicaons, China Letian Huang, University of Electronic Science and Technology of China, China **Program Chairs Zhikuang Cai, Nanjing University of Posts and Telecommunicaons, China Junyong Deng, Xi'an University of Posts & Telecommunicaons **Program Co-Chairs Zhixiong Di, Southwest Jiaotong University, China Delong Shang, Instute of Microelectronics of the Chinese Academy of Sciences, China Abdel-Hamid Ali Soliman, Staffordshire University, UK Alex Yakovlev, Newcastle University, UK **Program Committee Lu Zhu, Sun Yat-sen University, China Youming Zhang, Southeast University, China Weiguang Sheng, Shanghai Jiao Tong University, China Haizhi Song, University of Electronic Science and Technology of China,China Hao Gao, Austria & Eindhoven University of Technology, The Netherland Yun Fang, Silicon Austria Labs, Austria Jeff Kilby, Auckland University of Technology, New Zealand **Student Program Chairs Shiheng Yang, University of Electronic Science and Technology of China, China Chao Fan, Xi'an Jiaotong University, China **Special Session Chairs Chen Yang, Xi'an Jiaotong University, China Jianshi Tang, Tsinghua University, China Yuan Du, Nanjing University, China **Academic Committee Chairs Jin He, Peking University, China Fanyi Meng, Tianjin University, China **Academic Committee Kailin Ren, Shanghai University, China Yuanyuan Shi, University of Science and Technology of China, China Minghui Li, University of Glasgow, UK Wang Nan, Dalian University of Technology, China Wu Gao, Northwestern Polytechnical University, China **Publicity Chairs Huizhen Qian, University of Electronic Science and Technology of China, China Qiang Wu, Southwest Jiaotong University, China Jia Wang, Northwestern Polytechnical University, China Dengquan Li, Xidian University, China Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand Wei Ren, Xi’an University of Posts and Telecommunications, China ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 ==Preliminary Schedule== October 20, 2023---Onsite Sign-up, Workshop, Committee Meeting October 21, 2023---Openning Remarks, Keynote Speech and Parallel Sessions, Welcome Dinner& Best paper award October 22, 2023---Invited Speeches, Parallel Sessions, Farewell Dinner, Best presentations award October 23, 2023--- Academic / Social Program =CONTACT US= Ms. Jenny Chow Email: icicm_conf@vip.163.com Web: http://icicm.net/ Tel: (86)136-2777-7774 |
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