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CODES + ISSS 2023 : International Conference on Hardware/Software Codesign and System Synthesis

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Link: https://esweek.org/codes-isss/
 
When Sep 17, 2023 - Sep 22, 2023
Where Hamburg, Germany
Abstract Registration Due Mar 16, 2023
Submission Deadline Mar 23, 2023
Notification Due Jun 30, 2023
Categories    embedded systems   system architecture   simulation   embedded software
 

Call For Papers

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CODES+ISSS 2023
Call for Papers
International Conference on
Hardware/Software Codesign and System Synthesis
Hamburg, Germany, September 17-22, 2023
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The International Conference on Hardware/Software Codesign and System
Synthesis (CODES+ISSS) is the premier conference in system-level design,
hardware/software co-design, modeling, analysis, and implementation of
modern Embedded Systems, Cyber-Physical Systems, and Internet-of-Things,
from system-level specification and optimization to synthesis of
system-on-chip hardware/software implementations. CODES+ISSS is part
of Embedded Systems Week (ESWEEK), the premier event covering all
aspects of hardware and software design for smart, intelligent, and
connected computing systems.

https://esweek.org/wp-content/uploads/2023/01/CFP-CODESISSS-ESWEEK2023.pdf

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Timeline
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Journal Track:
- Abstract Submission: March 16, 2023 (AoE)
- Full Paper Submission: March 23, 2023 (AoE, firm)
- Notification of Acceptance: June 30, 2023

Work-in-Progress Track:
- Paper Submission: May 22, 2023 (AoE, firm)
- Notification of Acceptance: June 19, 2023

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Topics of Interests / Tracks
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Track 1) System-level design – Specification, modeling, refinement,
synthesis, and partitioning of embedded systems, hardware-software
co-design, hybrid system modeling and design, model-based design,
design for adaptivity and reconfigurability.

Track 2) Domain and application-specific design – Analysis, design,
and optimization techniques for multimedia, medical, automotive,
cyber-physical, IoT, and other application domains.

Track 3) System architecture – Heterogeneous systems, many-cores,
and distributed systems, architecture and micro-architecture design,
exploration and optimizations of application-specific processors and
accelerators, reconfigurable and self-adaptive architectures, storage,
memory systems, and networks-on-chip.

Track 4) Simulation, validation, and verification – Hardware/software
co-simulation, verification and validation methodologies, formal
verification, hardware accelerated simulation, simulation and
verification languages, models, and benchmarks.

Track 5) Embedded software – Language and library support, compilers,
runtimes, parallelization, software verification, memory management,
virtual machines, operating systems, real-time support, middleware.

Track 6) Safety, security, and reliability – Cross-layer reliability,
resiliency and fault tolerance, test methodology, design for security,
reliability, and testability, hardware security, security for embedded,
CPS, and IoT devices.

Track 7) Power-aware systems – Power-aware and energy-aware system
design and methodologies, ranging from low-power embedded and cyber-
physical systems, IoT devices, to energy-efficient large-scale
systems such as cloud datacenters, green computing, and smart grids.

Track 8) Embedded machine learning – Hardware and software design,
implementation, and optimization for machine learning that are
specially designed for resource- and power-constrained embedded,
CPS, and IoT devices.

Track 9) Industrial practices and case studies – Practical impact on
current and/or future industries, application of state-of-the-art
methodologies and tools in areas including wireless, networking,
multimedia, automotive, cyber-physical, medical systems, IoT, etc.

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Journal-Integrated Publication Model
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CODES+ISSS 2023 has a dual publication model with two tracks. Journal
track papers will be published in ACM Transactions on Embedded Computing
Systems (TECS) and Work-in-Progress track papers will be published in the
ESWEEK Proceedings. See details at https://esweek.org/author-information/

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Organization
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CODES+ISSS Program Chairs:
Mohammad Al Faruque, Univ. of California, Irvine, USA
Muhammad Shafique, NYU Abu Dhabi, UAE

ESWEEK General Chairs:
Xiaobo Sharon Hu, University of Notre Dame, USA
Alain Girault, INRIA, France

www.esweek.org

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