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EMSOFT 2023 : International Conference on Embedded Software

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Conference Series : Embedded Software
 
Link: https://esweek.org/emsoft/
 
When Sep 17, 2023 - Sep 22, 2023
Where Hamburg, Germany
Abstract Registration Due Mar 16, 2023
Submission Deadline Mar 23, 2023
Notification Due Jun 30, 2023
Final Version Due Jul 13, 2023
 

Call For Papers

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EMSOFT 2023
Call for Papers
International Conference on Embedded Software
September 17 – September 22, 2023, Hamburg, Germany
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The ACM SIGBED International Conference on Embedded Software (EMSOFT) brings together researchers and developers from academia, industry, and government to advance the science, engineering, and technology of embedded software development. Since 2001, EMSOFT has been the premier venue for cutting-edge research in the design and analysis of software that interacts with physical processes, with a long-standing tradition for results on cyber-physical systems, which compose computation, networking, and physical dynamics.

https://esweek.org/emsoft-call-for-papers-page/

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Timeline
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Journal-Track Submissions
- Abstracts: March 16, 2023 (AoE, Firm)
- Full Papers: March 23, 2023 (AoE, Firm)

Work-in-Progress Submissions
- May 22, 2023 (AoE, Firm)

Notification of Acceptance
- June 30, 2023 (both tracks)

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Topics of Interests / Tracks
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- Embedded distributed, networked systems
* Time-critical embedded systems
* Multi-/many-core processors, hardware accelerators
* Embedded operating systems and middleware
* Scheduling, resource allocation, and execution time analysis
* QoS management and performance analysis
* Hardware and software co-design
- Embedded software design and analysis
* Energy-efficient embedded software
* Safety/Mixed-critical embedded software
* Software design for cyber-physical systems
* Embedded software architectures for data-intensive applications and signal processing
- Resilience
* Embedded software security
* Robust implementation of control systems
- Process, methods
* Formal modeling and verification
* Testing, validation, and certification
* Model- and component-based approaches
- Empirical studies and their reproduction
- Sustainability, energy sobriety, low techs
- Application areas including automotive, avionics, energy, health care, mobile devices, multimedia, machine learning, and autonomous systems


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Journal-Integrated Publication Model
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EMSOFT 2023 solicits the submission of original research articles in two categories, i) full-length research papers that will be published in the the ACM Transactions on Embedded Computer Systems (TECS) and ii) short Work-in-Progress papers that will be published in the EMSOFT Proceedings. For both categories, EMSOFT solicits submission on all aspects of embedded software systems, including but not limited to the following topics. More information about the submission is at https://www.esweek.org/author-information.

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Organization
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EMSOFT Program Chairs:
Claire Pagetti, ONERA, FR
Alessandro Biondi, Scuola Superiore Sant'Anna, Italy

ESWEEK General Chairs:
Xiaobo Sharon Hu, General Co-Chair, University of Notre Dame, US
Alain Girault, INRIA, France

www.esweek.org

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