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FLEPS 2023 : IEEE International Conference on Flexible, Printable Sensors and Systems


When Jul 9, 2023 - Jul 12, 2023
Where Boston, MA, USA
Submission Deadline Mar 5, 2023
Notification Due Apr 21, 2023
Final Version Due May 5, 2023

Call For Papers

Organic/Inorganic Electronics and Sensors
Advanced Manufacturing Techniques
Hybrid Flexible Sensors and Electronics
Soft/Smart Wearable and Implantable Sensing Systems
Printed Large-Area Sensors and Systems
Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
Flexible/Printable Electronics in context with Circular and Green Electronics
Emerging Materials for Flexible and Printable Systems
High-throughput Printable Electronics
Stretchable/Shrinkable Sensors and Electronics
Disposable/Reusable Sensors and Electronics
Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
Reliability, Simulation and Modelling

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