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IEEE WCM 2023 : Special Issue on Green Technologies for the Sustainable Metaverse and Web 3.0, WCM

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Link: https://www.comsoc.org/publications/magazines/ieee-wireless-communications/cfp/green-technologies-sustainable-metaverse
 
When Jan 1, 2000 - Feb 15, 2023
Where N/A
Submission Deadline Feb 15, 2023
Notification Due Jun 1, 2023
Final Version Due Aug 1, 2023
Categories    metaverse   web 3.0
 

Call For Papers

The concepts of the Metaverse and Web 3.0 have grown in popularity as "the successor to the mobile Internet". The Web 3.0 is a paradigm shift of the Internet towards user-centric decentralization. The primary principles of Web 3.0 will be especially realized in the Metaverse, which is the next stage in the development of the Internet. The Metaverse is expected to be a seamless and interoperable integration of Artificial Intelligence (AI) driven virtual worlds populated by user generated contents (UGCs), and accessible through virtual/augmented reality (VR/AR) technologies.

Currently, many of these enabling technologies are energy hungry. Firstly, the physical-virtual world synchronization for world building in the Metaverse requires high resolution streaming of 3D objects and real-time execution of the perception-actuation loop on the Internet of Things (IoT). B5G/6G or next-generation WiFi would be the edge tools, with the basic technologies, such as large-scale antennae, ultra-dense networking, new multiple access technology, full spectrum access, etc. Secondly, the training of and inference using AI models are computationally intensive. Thirdly, the energy consumption per transaction on major blockchains still outweighs that of traditional payment systems. These problems are exacerbated when computation operations are pushed to the network edge across edge devices that have heterogeneous and dynamic constraints. The around-the-clock maintenance of the Metaverse will require intensive computation load and heavy data traffic. Therefore, network densification would have to continuously increase, with the strict constraints of data rates and latency, as well as the extreme bandwidth requirements for Metaverse applications. Under these circumstances, green technologies will have to be explored to realize the sustainable development of the Metaverse. Consequently, the topics of interest include, but are not limited to, the following:

New Architectures for green technologies for the Metaverse in Future Networking and Communications
Physical layer Technologies, such as MIMO, ultra-dense networking, etc., helped by Artificial Intelligence for green technologies for the Metaverse
Spectrum etiquette for spectral and energy efficiency in sustainable Metaverse and Web 3.0
Next-generation green communications-enabled applications over Metaverse
Computation-aware digital twin for Metaverse
Future Metaverse applications through/with computation power networking
Computation trading and interaction for the Sustainable Metaverse and Web 3.0
Optimization of Resource Allocation and Management for green technologies in the Metaverse
AI-driven green technology and application for the Sustainable Metaverse and Web 3.0
Security and Privacy Issues in green technologies for the Metaverse
Application of other emerging technologies, such as blockchain and edge computing, in the context of green technologies for the Metaverse
Experimental Prototyping and Testbeds of green technologies for the Metaverse
Submissions Guidelines
Prospective authors should prepare their submissions in accordance with the rules specified in the Information for Authors of the IEEE Wireless Communications guidelines.

Authors should submit a PDF version of their complete manuscript to Manuscript Central. The timetable is as follows:

Important Dates
Manuscript Submission Deadline: 15 February 2023
Initial Decision Date: 1 April 2023
Revised Manuscript Due: 1 May 2023
Final Decision Date: 1 June 2023
Final Manuscript Due: 1 August 2023
Publication Date: October 2023

Guest Editors


Xiaofei Wang
Tianjin University, China

Mehdi Bennis
University of Oulu, Finland

Ping Wang
York University, Canada

Rong Yu
Guangdong University of Technology, China

Wei Yang Bryan Lim
Nanyang Technological University, Singapore

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