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DSD 2023 : 26 th Euromicro Conference on Digital System Design


Conference Series : Digital Systems Design
When Sep 6, 2023 - Sep 8, 2023
Where Durres, Albania
Submission Deadline Apr 17, 2023
Notification Due May 29, 2023
Final Version Due Jun 16, 2023

Call For Papers


The Euromicro Conference on Digital System Design (DSD) addresses all aspects of (embedded, pervasive and high-performance) digital and mixed HW/SW system engineering, covering the whole design trajectory from specification down to micro-architectures, digital circuits and VLSI implementations. It is a forum for researchers and engineers from academia and industry working on advanced investigations, developments and applications.

It focuses on today’s and future challenges of advanced embedded, high-performance and cyber-physical applications; system and processor architectures for embedded and high-performance HW/SW systems; design methodology and design automation for all design levels of embedded, high-performance and cyber-physical systems; modern implementation technologies from full custom in nanometer technology nodes, through FPGAs, to MPSoC infrastructures.

Authors are kindly invited to submit their work according (but not limited) to the main topics of the conference main track. In addition, several Special Sessions (with their own coordinators and subprogram committees) do also welcome contributions in specific themes of particular interest. All papers are reviewed following guidelines, quality requirements and thresholds that are common to all committees.
Main Topics

Design and synthesis of systems, hardware and embedded software
IoT, cyber-physical and embedded systems
Autonomous/adaptable/re-configurable systems and architectures
Reliable, Secure, Safe and Optimized systems and their design methods
High-performance energy-efficient embedded systems and processor architectures
Highly-parallel multi- and many-core (heterogeneous) systems and architectures
Application analysis and parallelization for high-performance energy-efficient multi- and many-core embedded systems
Systems-on-a-chip, networks-on-a-chip and systems-in-a-package
Advanced applications of embedded and cyber-physical systems
Specification, modeling, analysis, validation and test for systems, hardware and embedded software
Formal Methods in System Design
Design automation at system, processor, register-transfer, logic and physical levels
New issues introduced by emerging applications and technologies

Best Paper Award

Based on the reviews and PC discussion, each track will nominate one paper for the Best Paper Award. The main track will nominate three papers. The Award Committee will select from them one paper for the Best Paper Award and three papers for the Outstanding Paper Award.

Submission Guidelines

Authors are encouraged to submit their manuscripts via Easychair web service at
Should an unexpected web access problem be encountered, please contact the Program Chairs by email ( and

Each manuscript should include the complete paper text, all illustrations, and references. The manuscript should conform to the IEEE format: single-spaced, double column, US letter page size, 10-point size Times Roman font, up to 8 pages. In order to conduct a blind review, no indication of the authors’ names should appear in the manuscript, references included. IEEE CPS Published

IEEE Conference Publishing Services (CPS) will publish accepted papers in the conference proceedings and the proceedings will be submitted to the IEEE Xplore Digital library and indexing services.

Extended versions of selected best papers will be published in a special issue of the ISI indexed Euromicro/Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) having the 2022 Impact Factor as high as 3.5 .

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