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ISLPED 2023 : ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED)


Conference Series : International Symposium on Low Power Electronics and Design
When Aug 7, 2023 - Aug 7, 2023
Where Vienna, Austria
Abstract Registration Due Mar 6, 2023
Submission Deadline Mar 13, 2023
Notification Due May 23, 2023
Final Version Due Jun 19, 2023
Categories    low power electronics   technology, a/d circuits   system-level design   ai/ml hardware / applications

Call For Papers

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, AI/ML-enhanced EDA/CAD, system-level design, and optimization, to system software and applications. Specific topics include, but are not limited to, the following three main tracks and sub-areas:

1. Technology, Circuits, and Architecture
1.1. Technologies
Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical, printable, biomedical, battery, and alternative energy storage devices and technology enablers for
non-Boolean and quantum/quantum-inspired compute models.

1.2. Circuits
Low-power circuits for logic, memory, reliability, yield, clocking, resiliency, near-/sub-threshold, and assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging and DC-DC converters; Energy-efficient circuits for emerging applications (e.g., biomedical, in-vitro sensing, autonomous), circuits using emerging technologies; Cryogenic circuits. Design technology co-optimization (DTCO) for low power.

1.3. Logic and Architecture
Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics, and other special purpose cores), cache, memory, arithmetic/signal processing, cryptography, variability, asynchronous design, and non-conventional computing. System technology co-optimization (STCO) for low power.

2. EDA, Systems, and Software
2.1. CAD Tools and Methodologies
CAD tools, methodologies, and AI/ML-based approaches for low-power and thermal-aware design. AI/ML for acceleration of circuit simulation and IP block design convergence. Power estimation, optimization, reliability, and variation impact on power optimization at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.

2.2. Systems and Platforms
Low-power, power-aware, and thermal-aware system design including data centers, SoCs, embedded systems, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and system-level power implications due to reliability and variability. Applications of AI/ML-based solutions and brain-inspired computing to power-aware system and platform design.

2.3. Software and Applications
Energy-efficient, energy/thermal-aware software and application design, including scheduling and management, power optimization through HW/SW codesign, and emerging low-power AI/ML applications.

3. Crosscutting Topics
3.1. AI/ML Hardware
Low-power AI/ML HW techniques including approximations, application driven optimizations, in-memory/energy-efficient accelerations, and neuromorphic computing; Energy-efficient AI/ML HW using emerging technologies (including quantum computing).

3.2. Hardware and System Security
Low-power hardware security primitives (PUF, TRNG, cryptographic/post-quantum cryptographic accelerators), nano-electronics security, supply chain security, IoT security and AI/ML security; Energy-efficient approaches to system security.

4. Industrial Design Track
ISLPED’23 solicits papers for an “Industrial Design” track to reinforce interaction between the academic research community and industry. Industrial Design track papers have the same submission deadline as regular papers and should focus on similar topics but are expected to provide a complementary perspective to academic research by focusing on challenges, solutions, and lessons learnt while implementing industrial-scale designs.

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