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ICMMM--Ei 2023 : 2023 10th International Conference on Mechanics, Materials and Manufacturing (ICMMM 2023)

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Link: http://www.icmmm.org/
 
When Aug 18, 2023 - Aug 20, 2023
Where Washington, D. C., USA
Submission Deadline Jun 25, 2023
Categories    materials science   nanotechnology   industrial engineering   mechanical engineering
 

Call For Papers

Abbreviation: ICMMM 2023
Full Name: 2023 10th International Conference on Mechanics, Materials and Manufacturing
Washington, D. C., USA
August 18-20, 2023
http://www.icmmm.org/


Call for Papers:
Composites
Surface Engineering/Coatings
Biomaterials and Chemical Materials
Powder Metallurgy
Building Materials
Environmental Friendly Materials
Materials Physics
Machine Design
Chemical Machinery and Equipment
Refrigeration and Air Conditioning
Power and Mechanical Engineering
Aerospace Systems and Technology
Mechanical Reliability Theory and Engineering
Mechatronics Sensing and Control
Sustainable Production
Recycling and Remanufacturing
Integrated Manufacturing System
More topics: http://www.icmmm.org/cfp.html

Publication:
Accepted and presented papers in ICMMM 2023 will be published into Conference Proceedings or Journals, as followings:
*Option I: Key Engineering Materials by TTP, which will be submitted for Ei Compendex, Scopus, Inspec (IET), etc. (only for papers related to Material)
*Option II: International Journal of Mechanical Engineering and Robotics Research (ISSN: 2278-0149 (Online), Abstracting/Indexing: Scopus, CNKI, Google Scholar, Crossref, etc. (only for papers related to Mechanical and Manufacturing)

Conference Venue: Capitol Technology University, USA
Add: 11301 Springfield RoadLaurel, MD 20708

Agenda Overview:
Day 1 August 18, 2023 Registration, or Online Pre-Test
Day 2 August 19, 2023 Plenary Meeting & Parallel Sessions
Day 3 August 20, 2023 Parallel Sessions

Submission Methods:
Full Paper(publication and oral presentation)
Abstract(oral presentation only)
Electronic Submission System (.pdf)
http://confsys.iconf.org/submission/icmmm2023

Contact:
Ms. Weng P. L. Hwang
E-mail: icmmm@zhconf.ac.cn
Tel: +1-661-888-4278(USA); +86-28-83207566(China Branch)

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