posted by user: FUN0524 || 1213 views || tracked by 5 users: [display]

IEEE SEAI 2023 : 2023 3rd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)

FacebookTwitterLinkedInGoogle

Link: http://www.seai.org
 
When Jun 16, 2023 - Jun 18, 2023
Where Xiamen, China
Submission Deadline Jan 25, 2023
Categories    intelligent systems   computer engineering   computational intelligence   machine learning
 

Call For Papers

Abbreviation: SEAI 2023
Full Name: 2023 3rd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)
Xiamen, China
June 16-18, 2023
http://www.seai.org


Publication:
All registered and presented papers will be published in Conference Proceedings, which will be submitted to Ei Compendex and Scopus.

Call for Paper:
Artificial Intelligence & Applications
AI Algorithms
Knowledge-based Systems
CAD Design & Testing
Software Engineering Techniques and Production Perspectives
Requirements Engineering
Software Analysis, Design and Modeling
Software Maintenance and Evolution
Multimedia and Hypermedia Software Engineering
Software Engineering Methodologies
Agent-based Software Engineering
Software & System Quality of Service
Soft Computing
Software and System Testing Methods
Software & System Security
Software and System Security and Privacy
Mobile APP Security and Privacy
Encryption Methods and Tools
Security Service Systems
More topics via: http://www.seai.org/topic.html

Agenda Overview´╝Ü
June 16, 2023 Conference check in and materials collection
June 17, 2023 Opening remarks+Keynote speeches in the morning
June 17, 2023 Parallel sessions in the afternoon
June 18, 2023 Academic Visiting & One-day Tour (Pending)

Venue: Pan Pacific Xiamen
Address: 19 Hubin Bei Road, Xiamen, Fujian, China 361012

Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System (.pdf)
http://confsys.iconf.org/submission/seai2023
or submit it via email: seai_conf@163.com.

Contact Us:
Ms. Ching Cao
E-mail: seai_conf@163.com
Tel: +86-13096333337

Related Resources

DEPLING 2023   International Conference on Dependency Linguistics
MLDM 2023   18th International Conference on Machine Learning and Data Mining
IEEE ICA 2022   The 6th IEEE International Conference on Agents
IJCNN 2023   International Joint Conference on Neural Networks
IEEE RE 2023   31st IEEE International Requirements Engineering 2023 conference
PAKDD 2023   The 27th Pacific-Asia Conference on Knowledge Discovery and Data Mining
SEAI 2023   2023 3rd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)
CFDSP 2023   2023 International Conference on Frontiers of Digital Signal Processing (CFDSP 2023)
ACM-Ei/Scopus-CWCBD 2023   2023 4th International Conference on Wireless Communications and Big Data (CWCBD 2023) -EI Compendex
IEEE COINS 2023   IEEE COINS 2023 - Berlin, Germany - July 23-25 - Hybrid (In-Person & Virtual) | Artificial Intelligence, Internet of Things (IoT), Blockchain, Big Data, Machine Learning