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Metaverse 2022 : Metaverse 2022, The 2022 IEEE International Conference on Metaverse

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Link: http://www.ieee-smart-world.org/2022/metaverse/
 
When Dec 15, 2022 - Dec 18, 2022
Where Haikou, China
Submission Deadline Sep 1, 2022
Notification Due Oct 1, 2022
Final Version Due Oct 31, 2022
Categories    cloud/edge/fog computing   ubiquitous/pervasive computing   high performance computing   green computing
 

Call For Papers

CFP: Metaverse 2022, The 2022 IEEE International Conference on Metaverse
CFP: Metaverse 2022 (Dec. 15-18, 2022, Haikou, China)
Dear Colleagues:
Please accept our sincere apologies if you receive multiple copies of this CFP.

Call for papers of Metaverse-2022
-------------------------------------------------------------------------------------------------------
The 2022 IEEE International Conference on Metaverse (Metaverse-2022)
http://www.ieee-smart-world.org/2022/metaverse/
December 15-18, 2022,Haikou, China
-------------------------------------------------------------------------------------------------------
***** SCOPE *****
With the network communication, security, and computing technologies, The 2022 IEEE International Conference on Metaverse (Metaverse-2022) will be a primal international forum for scientists, engineers, and researchers to exchange their novel research regarding advancements in the state-of-art of metaverse, as well as to identify the emerging research topics and open issues for further research.


***** TOPICS *****
Topics of interest include, but are not limited to the following.
• Cloud/Edge/Fog Computing
• Ubiquitous/Pervasive Computing
• High Performance Computing
• Green Computing
• IOT & Sensor Networks
• Mobile & Wireless Networks
• 5G/6G/F5G/F6G Networks
• VR, AR and MR
• Holographic Technology
• Brain Computer Interaction
• Somatosensory Interaction
• 3D AI Modeling
• AI Game Engines
• Real Time AI Rendering
• Privacy and Authentication
• Secure Dissemination and Data Validation
• AI Security
• Hardware Security
• Smart Contract, Hyper Ledger and Blockchain
• Security of NFT
• Cryptographic Applications
• Natural Language Processing
• Computer Vision
• Machine Learning
• Intelligent Voice
• Smart Machines and Robots
• Smart Vehicles and Control
• Smart Industries


***** IMPORTANT DATES *****
• Workshop Proposal: Jul. 15, 2022
• Paper Submission: Sep. 01, 2022
• Author Notification: Oct. 01, 2022
• Camera-ready Due: Oct. 31, 2022
• Conference Dates: Dec. 15-18, 2022


***** SUBMISSION AND PUBLICATION *****
Main conference papers are limited to 8 pages (regular paper), or 6 pages (short paper), and 2-4 pages for a poster paper following the IEEE proceedings format, and are to be submitted as PDF via the site: (Coming soon).

Accepted conference papers will be published by IEEE (IEEE-DL and EI indexed). At least one author of each accepted paper is required to register and present their work at the conference; otherwise, the paper will not be included in the proceedings. Selected papers, after further extensions and revisions, will be recommended to special issues. More details at the conference website: http://www.ieee-smart-world.org/2022/metaverse/


***** SPECIAL ISSUES *****
(Coming soon)


GENERAL CHAIRS
Ian F. Akyildiz, Truva Inc., USA
Xueming Si, Fudan Uni., China
Zhigeng Pan, Nanjing Uni. of Infor. Sci. and Tech., China

EXECUTIVE CHAIRS
Mérouane Debbah, Tech. Innovation Institute, Abu Dhabi
Martin Reisslein, Arizona State Uni., USA
Huazhong Liu, Hainan Uni., China

PROGRAM CHAIRS
Cédric Westphal, Futurewei, USA
Debiao He, Wuhan Uni., China
Wei Wang, Huazhong Uni. of Sci. and Tech., China

PROGRAM VICE-CHAIRS
Kan Chen, Singapore Institute of Tech., Singapore
Mithun Mukherjee, Nanjing Uni. of Infor. Sci. and Tech., China

PUBLICITY CHAIRS
Xiaoxue Yin, Hainan Uni., China
Mengling Huang, Huazhong Uni. of Sci. and Tech., China

LOCAL CHAIRS
Hao Feng, Hainan Uni., China
Jihong Ding, Hainan Uni., China

WEB CHAIRS
Jiawei Wang, St. Francis Xavier Uni., Canada
Dongli Liu, Huazhong Uni. of Sci. and Tech., China

STEERING CHAIRS
Laurence T. Yang, St Francis Xavier Uni., Canada
Jianhua Ma, Hosei Uni., Japan

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