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eMDC & ISSM 2011 : e-Manufacturing & Design Collaboration Symposium & International Symposium on Semiconductor Manufacturing (eMDC & ISSM)

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Link: http://www.tsia.org.tw/Seminar/eManufacturing/2011/
 
When Sep 5, 2011 - Sep 6, 2011
Where Hsinchu, Taiwan
Submission Deadline Jun 1, 2011
Notification Due Jun 20, 2011
Final Version Due Jul 27, 2011
Categories    semiconductor   manufacturing   e-manufacturing
 

Call For Papers

In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:

* Advanced Lithography
* Benefits and Justification (ROI, CoO, OEE ...)
* Contamination Control and Ultraclean Technology
* Control Architecture/Engineering/IT Infrastructure
* Cross-industrial Applications of PV/SSL/FPD/…
* Data Collection/Quality/Storage/Management
* Design for Manufacturing/Testing/Yield
* e-Diagnostics, e-Manufacturing, and EEC
* Engineering/Supply/Value Chains
* Environment, Safety and Health
* Equipment Control/Integration
* Fab Management/Scheduling/Dispatching
* Factory Design & Automated Material Handling
* Factory Integration/Operations
* Factory Physics & Queueing Operations
* Fault Detection/Classification and Sensors
* Final/Lean/Green Manufacturing
* Manufacturing Control and Execution Systems
* Manufacturing Strategy and Operation Management
* Next Generation Factory & 450mm Wafers
* Predictive/Preventive Maintenance
* Process and Material Optimization
* Process and Metrology Equipment
* Process Control and Monitoring
* Process Modeling and Model-Based Simulations
* Process/Tool/Sensor Integrations
* Standards (Equipment, Communications, …)
* Through Silicon Via & 3D Structures
* Ultra High Productivity in High-Volume Manufacturing
* Yield Enhancement and WIP Management

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