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15th IEEE MCSoC 2022 : 15th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip

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Link: https://www.mcsoc-forum.org/
 
When Dec 19, 2022 - Dec 22, 2022
Where Universiti Sains Malaysia, Malaysia
Submission Deadline Oct 25, 2022
Notification Due Nov 1, 2022
Final Version Due Nov 10, 2022
Categories    embedded systems   AI   system on chip   embedded, cyber-physical, and
 

Call For Papers

************************************CFP************************** ******************
15th IEEE MCSoC2022
Universiti Sains Malaysia, Penang, Malaysia, Dec. 19-22, 2022
URL: https://mcsoc-forum.org/
****************************************************************** ******************
The 15th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC-2022) aims to provide the world’s premier forum of leading researchers in the Embedded Multicore/Many-core SoCs software, tools, and applications design areas for academia and industries. From the 2018 edition, the MCSoC symposium targets new emerging topics related to multicore neuro-inspired computing architectures and systems. Prospective authors are invited to submit their contributions. Submission of a contribution implies that at least one of the authors will have a full registration to the symposium upon acceptance of his/her contribution. Submission can include, technical and experimental, theoretical, conceptual, or a survey.

***Technical Tracks***
* Embedded Multicore/Manycore SoC Programming
Chair: Stephane Louise (CEA, LIST, France)
* Embedded Multicore/Manycore SoC Applications
Chair: TBC
* Embedded Multicore/Manycore SoC Architectures
Chair: William J. Song (Yonsei Univ, Korea)
* Embedded Multicore/Manycore SoC Real-Time Systems
Chair: Yi-Chung Chen (SUNY, USA)
* Embedded Multicore/Manycore SoC Design
Chairs: Diana G?hringer (TUD, Germany), Cristinel Ababei (Marquette Univ, USA
* Secure and Fault-Tolerant Embedded Computing
Chair: Chun-Ming Huang (TSRI, Taiwan)
* Embedded Multicore/Manycore SoC Interconnection Networks
Chair: Jos? L. Abell?n (UCAM, Spain)
* Machine Learning for Energy-efficient Manycore Interconnects
Chair: Kun-Chih Chen (National Sun Yat-sen University, Taiwan)
* Embedded Multicore/Manycore SoC Testing
Chair: Yeong-Kang Lai (NCHU, Taiwan)
* Embedded Neuromorphic Computing Systems
Chair: Gianvito Urgese (PoliTO, Italy)
* Embedded Multicore/Manycore SoC Design Automation and Low-power Design
Chairs: Fakhrul Z. Rokhani (UPM, Malaysia)
* Hardware Acceleration for AI on the Edge
Chair: Lan-Da Van (NYCU, Taiwan)
* Operating Systems Platforms for Real-Time Embedded Applications
Chair: Tsung-Tai Yeh (National Yang Ming Chiao Tung University, Taiwan)

***Special Tracks***
* Embedded, Cyber-Physical, and IoT Systems
Chair: Xuchong Zhang (Jiaotong University, China)
* Embedded Applications and Ubiquitous Computing
Chair: Chih-Peng Fan (National Chung Hsing University, Taiwan)
* Embedded Neuroprosthetics, Technologies, and Devices
Chair: Chun-Shu Wei (Nat. Yang Ming Chiao Tung Univ. , Taiwan)
* Embedded Machine Learning, and Data Analytics
Chair: Yuan Du (Nanjing University, Nanjing, China)

***Special Sessions & Workshops***
* Auto-Tuning for Multicore and GPU (ATMG2022)
Chair: Daichi Mukunoki (RIKEN, Japan)
* Emerging Machine Learning and Deep Learning Models: Theory and Applications
Chair: Jungpil Shin (The University of Aizu, Japan)
* Distributed Computing and Communication Techniques for Emerging AI Applications
Chair: Peng Li (Univ. of Aizu, Japan)
* Low-power and Solutions for Future SoC design
Chairs: Akram Ben Ahmed (AIST, Japan), Hayate Okuhara (UNIBO, Italy)
* Intelligent Systems and Learning Technologies: Models, Methods, and Applications Chairs: Mohamed Hamada (Univ. of Aizu, Japan), Sarika Jain (NITKKR, India)

***Proceedings Publication and Indexing***
The 15th MCSoC-2022 proceedings, including all technical tracks, special tracks, and special sessions and workshops papers, will be published by IEEE CS Press, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.

***Submission System***
https://edas.info/N29397

***Important dates

**1st Round Submission**
-Abstract submission: July 31, 2022
-Full Paper submission: June 5, 2022
-Acceptance notification: August 31, 2022
-Camera-ready paper: September 15, 2022

**2nd Round Submission**
-Full Paper submission: October 25th, 2022
-Acceptance notification: November 1st, 2022.
-Camera-ready paper and Author Registration: November 10th, 2022
-Symposium date: December 19-22, 2022


***Best Paper Award and Journal Special Issues***
Three accepted papers will be selected for best paper awards.
Selected papers will be recommended to the following Journals for potential fast-track publications: (TBC).

***********************************Organizing Committee******************
*Honorary Chairs*
- Abdul Rahman Mohamed, USM, Malaysia
- Hiderharu Amano, Keio Univ. Japan
*Conference Committee Chairs*
- Shahrel Azmin Suandi, USM, Malaysia
- Tee Hui Teo, SUTD, Singapore
- Bernard Lim, Appscard, Malaysia
*Program Chairs*
- Lan-Da Van , NYCU, Taiwan
- Khanh N. Dang VNU, Vietnam
*Special Session Chairs*
- Akram Ben Ahmed, AIST, Japan
- Asrulnizam Bin Manaf USM, Malaysia
*Publicity Chairs*
- Hiroshi Saito, Univ. of Aizu, Japan
- Chee Huei Lee, SUTD, Singapore
*Publication Chair*
- Nor Azlin Ghazali, USM, Malaysia
*Registration Chair*
- Khanh N. Dang, VNU, Vietnam
*Website Manager*
- Ogbodo Mark Ikechukwu, Univ. of Aizu, Japan
*Industrial Chair*
- Ong Chin Hu, (StarFive, Malaysia)
*Student Program Chair*
- Nur Zatil ‘Ismah Hashim, USM, Malaysia

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