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EMSOFT 2022 : International Conference on Embedded Software


Conference Series : Embedded Software
When Oct 7, 2022 - Oct 14, 2022
Where Hybrid-Shanghai
Abstract Registration Due Mar 31, 2022
Submission Deadline Apr 7, 2022
Notification Due Jul 5, 2022
Categories    embedded software   modeling   middleware   scheduling

Call For Papers

Call for Papers
International Conference on Embedded Software
October 07 – October 14, 2022, Hybrid-Shanghai

The ACM SIGBED International Conference on Embedded Software (EMSOFT)
brings together researchers and developers from academia, industry,
and government to advance the science, engineering, and technology of
embedded software development. Since 2001, EMSOFT has been the premier
venue for cutting-edge research in the design and analysis of software
that interacts with physical processes, with a long-standing tradition
for results on cyber-physical systems, which compose computation,
networking, and physical dynamics.

Journal-Track Submissions
- Abstracts: March 31, 2022 (AoE, Firm)
- Full Papers: April 7, 2022 (AoE, Firm)

Work-in-Progress Submissions
- June 11, 2022 (AoE, Firm)

Notification of Acceptance
- July 5, 2022 (both tracks)

Topics of Interests / Tracks
* Embedded / cyber-physical software design and analysis
* Safety-critical and mixed-critical embedded software design
* Time-critical embedded software
* Formal modeling and verification
* Testing, validation, and certification
* Model- and component-based approaches
* Robust implementation of control systems
* Embedded operating systems and middleware
* Embedded distributed, networked systems
* Embedded software on multi- and many-core processors
* Scheduling, resource allocation, and execution time analysis
* QoS management and performance analysis
* Hardware and software design for safe autonomy
* Embedded software security
* Energy-efficient embedded software
* Embedded software architectures for data-intensive applications and
signal processing
* Empirical studies and their reproduction
* Application areas including automotive, avionics, energy, health care,
mobile devices, multimedia, machine learning, and autonomous systems

Journal-Integrated Publication Model
EMSOFT 2022 solicits the submission of original research articles in two
categories, i) full-length research papers that will be published in the
IEEE Transactions on Computer-Aided Design of Integrated Circuits and
Systems (TCAD), and ii) short Work-in-Progress papers that will be
published in the EMSOFT Proceedings. For both categories, EMSOFT solicits
submission on all aspects of embedded software systems, including but not
limited to the following topics. More information about the submission is

EMSOFT Program Chairs:
David Broman, KTH Royal Institute of Technology, SE
Claire Pagetti, ONERA, FR

ESWEEK General Chairs:
Aviral Shrivastava, Arizona State University, US
Xiaobo Sharon Hu, General Co-Chair, University of Notre Dame, US

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