The 2022 3rd International Conference on Materials, Physics and Computers (MPC 2022) is organized by International Engineering and Technology Institute, co-organized by NanoFemto Lab, Canada, Center for Advanced Diffusion-Wave and Photoacoustic Technologies (CADIPT), Department of Mechanical and Industrial Engineering, University of Toronto, Canada, Hohai University Institute of Physics, China, Interactions, Dynamics, and Energetics in the Atmosphere (IDEA) Team, The Pennsylvania State University, USA, Integrated Energy Solutions for Entrepreneurs (IESE) Program, The Pennsylvania State University, USA, Wuhan University of Technology Nano Key Lab, China, Department of Mechanical Engineering, Northern Illinois University, USA. This conference will be held on July 30-31 2022 in Kuala Lumpur, Malaysia (online conference by ZOOM). A material is a substance or mixture of substances that make up an object. Materials can be pure or impure, living or inanimate substances. Materials can be classified according to their physical and chemical properties, or according to their geological origin or biological function. Physics is a natural science that studies matter, its basic components, its movement and behavior in space and time, and the related entities of energy and force. A computer is a digital electronic machine that can automatically perform a series of arithmetic or logical operations (calculations) through programming. Modern computers can execute a general set of operations called programs. These programs enable computers to perform a wide range of tasks. Materials, physics, and computers are the three important cornerstones of the development of modern society, so the research on these three aspects is very meaningful. The conference invites international scholars to make conference reports and present the latest research results, aiming to become the flagship academic conference in the field of materials engineering, physics and computer technologies. MPC will provide a first-class academic exchange platform for academicians, professors, researchers and teachers and students in the world. The meeting will be exchanged in the form of conference reports, group reports, and paper publications. At the same time, to recognize outstanding manuscripts, the conference set the best paper awards. This conference is focused to address a wide range of the theoretical aspects and applications of materials, physics, computers.

Topics of interest for submission include, but are not limited to:
*Materials physics, materials analysis, and characterization.
*Materials science and physical chemistry of materials.
*Metallic materials: structure, properties, technologies.
*Non-metallic materials: structure, properties, technologies.
*Composite and powder materials.
*Building materials: structure, properties, technologies.
*Nanomaterials Coating and surface treatment.
*Modeling the structure, properties of materials.
*Modern problems of foundry, steels, alloys.
*Material processing Theory and technology of welding production.
*Chemical and hydrometallurgical technologies.
*Theory and technology of metallurgical and metalworking processes.
*Methods of control and analysis of materials.
*Classical Continuum Physics.
*Theoretical, Mathematical & Computational Physics.
*Particle and Nuclear Physics Physical Chemistry.
*Atomic, Molecular, Optical & Plasma Physics.
*Applied & Technical Physics Quantum Physics.
*Biophysics & Biological Physics Biochemistry & Biophysics.
*Nanotechnology Astrophysics and Astroparticles.
*Condensed Matter Physics.
*Geophysics.
*Statistical Physics & Dynamical Systems.
*Extraterrestrial Physics, Space Sciences Environmental Engineering and Physics Physical & Information Science.
*Computers for Materials and Physics.
*Electrical Engineering.
*Electronics and Communication.
*Computer Science & Engineering.
*Civil Engineering.
*Mechanical Engineering.
*Chemical Engineering.
*Instrumentation Engineering.

Proceedings of MPC will be published by IOP Publishing - Journal of Physics: Conference Series, which is indexed by Scopus, Ei Compendex, Inspec(IET), etc.

Registeration fee: 150-180 USD (Listeners: Free)

Please login in the Electronic Submission System to submit your paper: https://www.morressier.com/call-for-papers/620ba6549b52e4001380dcde

For any information about conference, please contact us:
the editor
mohammed.kaabar@wsu.edu (Prof. Mohammed Kaabar)

The conference organizer
ismcft@yeah.net and info@ieti.net
Conference website: http://ieti.net/m/index.html