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SYSINT 2022 : 6th International Conference on System-Integrated Intelligence Intelligent, flexible and connected systems in products and production

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Link: https://sysint-conference.org/
 
When Sep 7, 2022 - Sep 9, 2022
Where Genova, Italy
Submission Deadline Apr 1, 2022
Notification Due Jun 1, 2022
Final Version Due Jul 1, 2022
Categories    intelligent systems   IOT   human machine interaction   ubiquitous computing
 

Call For Papers

SysInt is an international conference about system-integrated intelligence,
held biannually. The conference provides a forum for academia and industry to
disseminate their latest innovations and practices in field of system-integrated intelligence. The goal is to present recent and exciting results on the integration of
new, intelligent functionalities into materials, components, systems and products. The conference addresses industry and society needs, requirements and expectations.

**Remote participation will be possible**

The technical committee invites authors to submit maximum 5-page papers in
standard double-column format, including figures and tables, to clearly present the
work, methods, originality, significance and applications of the techniques discussed. The last page should be dedicated to references.

All accepted papers will be published in proceedings with ISBN and DOI.

The 6th edition will take place in Genova, Italy. The conference will be organized into the following Scientific Tracks

Topics and Tracks:

• Artificial Intelligence
• Pervasive and Ubiquitous Intelligence
• Sensors and Sensing Systems
• Smart Factory and Logistic Systems
• Structural Health Monitoring
• Soft Robotics
• Human Machine Interaction
• Cognitive Systems



GENERAL CHAIR

Maurizio Valle, Univ. of Genoa, Italy

ORGANIZING COMMITTEE

Stefan Bosse, Univ. of Bremen, Ger.
Christian Gianoglio, Univ. of Genoa, Ita.
AleksandraHimstedt,BremerInstitutBIBA,Ger.
Ali Ibrahim, Lebanese Int. Univ., Leb. and
Univ. of Genoa, Ita.
Dirk Lehmhus, Fraunhofer IFAM, Ger.
Edoardo Ragusa, Univ. of Genoa, Ita.
Silvia Ferrari, Pragma Congressi srl, Ita.

INTERNATIONAL SCIENTIFIC COMMITTEE

Giovanni Berselli, Univ. of Genoa, Ita.
Stefan Bosse, Univ. of Bremen, Ger.
Lorenzo Capineri, Univ. of Florence, Ita.
Fu-Kuo Chang, Stanford Univ., USA
Hussein Chible, Lebanese Univ., Leb.
Nikolaus Correll, Univ. Colorado Boulder, USA
Berend Denkena, Univ. of Hanover, Ger.
Nikhil Gupta, New York Univ, USA
Dirk Lehmhus, Fraunhofer IFAM, Ger.
Stefano Mariani, Polytechnic of Milan, Ita.
YasserMohanna, LebaneseUniv., Leb.
Hassan Mostafa, Cairo Univ., Egy.
Max Pfingsthorn,Univ. ofOldenburg,Ger.
PierPaoloPompa, ItalianInst.ofTechnology,Ita.
Michael Sinapius, TU Braunschweig, Ger.
Klaus-Dieter Thoben, Univ. of Bremen., Ger.
Flavio Tonelli,Univ. ofGenoa, Ita.
ThorstenWuest, West VirginiaUniv,USA

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