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ESREF 2022 : ESREF 2022

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Link: https://www.esref2022.org/
 
When Sep 26, 2022 - Sep 29, 2022
Where Dublin
Submission Deadline Mar 11, 2022
Final Version Due May 19, 2022
Categories    micro electronics
 

Call For Papers



Welcome to ESREF 2022 in Berlin!

ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Berlin (Germany) from September 26-29, 2022 at the H4 Hotel Berlin Alexanderplatz.

This international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for all aspects of reliability management and innovative analytical techniques for present and future electronic applications.

SCOPE OF PAPERS
High quality abstracts are accepted for presentation
at ESREF and publication in Microelectronics Relia-
bility Journal. They should contribute to reliabi-
lity concepts, the understanding and analysis
of failure mechanisms by means of innovative
methods in failure analysis, measurement, cha-
racterisation or modelling. During submission the
authors will be asked to give their preferences with
regards one or more tracks as described below:

• A - Assessment Techniques and Methods for Devices and Systems
• B - Semiconductor and Nanoelectronics Technologies
• C - Progress in Failure Analysis Methods
• D - Microwave Devices and Circuits
• E - Packaging and Assemblies
o E1 – Wafer- and Panel-Level Interconnection Technologies
o E2 – Second-Level Interconnects
• F - Power Devices and Systems
o F1 – Smart Power Devices, IGBT, Thyristors
o F2 – Wide Bandgap Power Devices
o F3 - Power Electronic Systems
• G - Photonics Devices
• H - MEMS and Sensors
• I - Extreme Environments and Radiation

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