posted by user: FUN0524 || 3990 views || tracked by 14 users: [display]

ACM--ICCAI--Ei Compendex, Scopus 2022 : ACM--2022 8th International Conference on Computing and Artificial Intelligence (ICCAI 2022)--Ei Compendex, Scopus

FacebookTwitterLinkedInGoogle

Link: http://www.iccai.net/
 
When Mar 18, 2022 - Mar 21, 2022
Where Tianjin, China
Submission Deadline Feb 10, 2022
Categories    computing   artificial intelligence   systems engineering   computer science
 

Call For Papers

Full name: 2022 8th International Conference on Computing and Artificial Intelligence
Abbreviation: ICCAI 2022

2022 8th International Conference on Computing and Artificial Intelligence (ICCAI 2022) which is organized by Tiangong University, supported by Beijing University of Technology, Hebei University of Technology, Tianjin University, Sichuan University, and Shanghai Jiao Tong University will be held in Tianjin, China during March 18-21, 2022.

Conference Website: http://www.iccai.net/


Shining Points:
1. Previous Keynote Speakers: Prof. Nikola Kasabov, IEEE Fellow and RSNZ Fellow, Auckland University of Technology, New Zealand; Prof. David Zhang, IEEE Fellow and IAPR Fellow, Chinese University of Hong Kong (Shenzhen), China; Prof. Yiu-ming Cheung, IEEE Fellow and IET Fellow, Hong Kong Baptist University, China.
2. ICCAI papers have been published in ACM conference proceedings, archived in ACM Digital Library, indexed by Ei Compendex and Scopus for four consecutive years.
3. SCI-indexed Journal publication

Publication:
1. Conference Proceedings by ACM (ISBN: 978-1-4503-9611-0): archived in ACM Digital Library, indexed by Ei Compendex and Scopus, and submitted to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science).
2. International Journal of Computer Theory and Engineering (IJCTE, ISSN: 1793-8201): indexed by EI (INSPEC, IET), Google Scholar, ProQuest, etc,.
3. SCI indexed journal: Applied Sciences (ISSN: 2076-3417): indexed by SCIE (Web of Science), Scopus, Inspec, CAPlus / SciFinder, etc. IF: 2.679, CiteScore: 3.0

Topics of interest for submission include, but are not limited to:
Intelligent Computing: Genetic algorithm; Simulated annealing algorithm; Taboo search algorithm
Artificial Intelligence and its Applications: Biometrics; Pattern Recognition; Computer vision
Computer and Information Technology: Embedded systems; Signal, image and speech processing; Software engineering

Conference Venue
Tiangong University, Tianjin, China
Adderss: No. 399 Bin Shui Xi Road, Xi Qing District, Tianjin 300387, P.R. of China
Website: http://en.tjpu.edu.cn/

Submission and Contact Methods
Submission Methods: http://confsys.iconf.org/submission/iccai2022
E-mail: iccai@cbees.net
Tel: +852-3500-0799 (English)/+86-28-86528465 (Chinese)
Conference Secretary: Ms. Olia Lai

ICCAI 2022 can provide a platform for academic communication in Computing and Artificial Intelligence and related areas. For more conference information, please visit the conference website: http://www.iccai.net/

Related Resources

ACM-EI/Scopus-ITCC 2023   2023 3rd International Conference on Information Technology and Cloud Computing (ITCC 2023) -EI Compendex
ACM ICCBDC 2023   ACM--2023 7th International Conference on Cloud and Big Data Computing (ICCBDC 2023)
ACM-Ei/Scopus-CWCBD 2023   2023 4th International Conference on Wireless Communications and Big Data (CWCBD 2023) -EI Compendex
ICCBDC 2023   ACM--2023 7th International Conference on Cloud and Big Data Computing (ICCBDC 2023)
ICCV 2023   International Conference on Computer Vision
ICMLT 2023   ACM--2023 8th International Conference on Machine Learning Technologies (ICMLT 2023)
ACM-Ei/Scopus-CNIOT 2023   2023 4th International Conference on Computing, Networks and Internet of Things (CNIOT 2023) -EI Compendex
CCCE 2023   Springer--2023 3rd International Conference on Computer and Communication Engineering (CCCE 2023)--EI Compendex, Scopus
ICNLP 2023   2023 5th International Conference on Natural Language Processing (ICNLP 2023)
ICSE 2024   The IEEE/ACM International Conference on Software Engineering (Second Round)