posted by user: cmuthu_urv || 3559 views || tracked by 3 users: [display]

SCD 2011 : Semiconductor Conference Dresden

FacebookTwitterLinkedInGoogle

Link: http://www.gerotron.de/html/messen/scd.htm
 
When Sep 27, 2011 - Sep 28, 2011
Where Dresden, Germany
Submission Deadline Mar 1, 2011
Notification Due Jul 1, 2011
Final Version Due Aug 1, 2011
Categories    semiconductor
 

Call For Papers

Major Topics

Integrated Circuit and System Design:
Mixed-signal, analogue and digital circuits and systems for high speed and/or low power consumption, adaptive power management, RF up to sub-THz, low costs, and advanced performance and density, circuits in More than Moore and Beyond Moore technologies.

Interconnection Technologies:
Wire bonding, flip chip (eutectic/lead-free solders), solder replacement flip chip (ICP, ACP, ACF, NCP), under bump metallurgy, high density substrates, microvia, build-up technologies, substrate metallurgy, embedded passives & actives, wafer/device level, MEMS, 3-D and novel interconnects.

Advanced System and Wafer Level Packaging:
New packaging technologies for single chip, multi-chip, wafer level, power and stacked-die packages addressing fine pitch, high I/O and performance issues, low loss interconnects and bonding techniques.

Optical Devices and Photonics:
Optical component assemblies, electro-optical modules, waveguides, silicon based photonic devices, organic devices.

Semiconductor Technologies, Materials and Processes:
CMOS, SiGe, More than Moore (silicon on insulator, strained silicon, multi-gate transistors) and Beyond Moore including carbon nano tubes, silicon nanowire, organic, polymer and ink-jet printed electronics, power devices (GaN, GaP), advances and application of adhesives, encapsulants, underfills, solder alloys, halogen-free materials, dielectrics, thin films, ceramics, composites, nano-materials, optical materials and characterization techniques, wafer (prime) production.

Assembly and Manufacturing Technologies:
Wafer bumping and thinning, process characterization, cost and cycle time reduction, etc..

Quality and Reliability:
Component, board and system level reliability assessment, failure analysis, interfacial adhesion, accelerated testing and
models, component and system qualification.

Modeling and Simulation:
EDA, TCAD, electrical, thermal, thermo-mechanical, reliability, optical, modeling and simulation for devices, component and system level applications.

Related Resources

OPTLJ 2021   Integrated Optics and Lightwave : An International Journal
FPL 2021   Field-Programmable Logic and Applications