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SLIP 2021 : 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding

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Conference Series : System-Level Interconnect Prediction
 
Link: http://www.sliponline.org/
 
When Nov 4, 2021 - Nov 4, 2021
Where Virtual Event
Submission Deadline Sep 5, 2021
Notification Due Sep 20, 2021
Final Version Due Sep 30, 2021
Categories    system-level interconnects   2.5/3d architectures   computer architecture   design automation
 

Call For Papers

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23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP 2021)
http://www.sliponline.org/

Co-hosted with the
ACM/IEEE International Conference On Computer Aided Design (ICCAD 2021)

November 4, 2021 - Virtual Event
Accepted papers are published in ACM/IEEE proceedings.
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The 23rd ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP), co-hosted with ICCAD 2021, will bring together researchers and practitioners who have a shared interest in the challenges and futures of system-level interconnect, coming from wide-ranging backgrounds that span system, application, design, and technology. 

Original submissions in the form of regular technical papers, invited sessions, workshop discussion topics, and posters are welcome. Program content is accepted based on novelty and contributions to the advancement of the field. 

Please take a look at the Call for Papers (http://sliponline.org/CFP-SLIP-2021.pdf), and we look forward to receiving your submissions and "seeing" you at the SLIP workshop! 


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SUBMISSION
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We invite authors to submit papers of 4 to 8 pages, double columned, 9pt/10pt font in ACM proceedings format (https://www.acm.org/publications/proceedings).
To permit double blind review, all papers must remove author information. Authors should submit papers electronically via the following link (https://easychair.org/conferences/?conf=slip2021).


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IMPORTANT DATES
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Paper Submission: September 5, 2021
Author Notification: August 31, 2021 (early papers)
September 20, 2021 (late papers)
Final Version Upload: September 30, 2021

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ORGANIZING COMMITTEE
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General Chair: 
Mustafa Badaroglu (Qualcomm, Belgium)

Steering Committee Chair: 
Dirk Stroobandt (Ghent University, Belgium)

Technical Program Co-Chairs: 
Brian Cline (Arm, USA)
Ismail Bustany (Xilinx, USA)

Special Session Co-Chairs: 
Pascal Vivet (CEA, France)
Yuzo Fukuzaki (TechInsights, Canada)

Finance Chair: 
Ivan Ciofi (imec, Belgium)

Publicity Chair: 
Poona Bahrebar (Ghent University, Belgium)

Publications Chair: 
Seungwon Kim (University of California, San Diego, USA)


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