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VAR_electronics 2022 : Special Issue “Advances in Tangible and Embodied Interaction for Virtual and Augmented Reality


When N/A
Where N/A
Submission Deadline Apr 30, 2022
Categories    virtual reality   tangible interaction   embodied interaction   augmented reality

Call For Papers

Dear Colleagues,

Virtual and augmented reality technology has seen tremendous progress in recent years, enabling novel and exciting ways to interact inside virtual environments. An interesting approach to interaction in VR and AR is the use of tangible user interfaces, which leverage on our natural understanding of the physical world and how our bodies move and interact with it, and on our learned capabilities to manipulate physical objects.

For this Special Issue, we are interested in gathering research that bridges atoms and bits in virtual and augmented environments. Basic research papers that demonstrate new interaction technologies or techniques, descriptions of applications that use tangibles in VR/AR in any domain, and survey papers that can help structure and systematize current knowledge on this area are all suitable. Topics of interest include, but are not limited to:

Technologies for object detection/recognition in AR
Interaction techniques that use tangibles/embodied interactions
Haptic systems and interactions for VR/AR
Authoring systems
Programming libraries, toolkits, and frameworks
Applications in cultural heritage, medicine, rehabilitation, gaming, entertainment, teaching, training, visualization, etc.
Design methodologies
Evaluation methodologies

Dr. Jorge C. S. Cardoso
Dr. André Perrotta
Dr. Paula Alexandra Silva
Dr. Pedro Martins
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

virtual reality
VR/AR applications
brain science for VR/AR
VR/AR collaboration
computer graphics for VR/AR
tangible interaction
embodied interaction
multimodal VR/AR
human–computer interactions in VR/AR
human augmentations with VR/AR
human–computer interactions in VR/AR
human factors in VR/AR
programming libraries/toolkits for VR/AR
360 video
3D experiences
digital storytelling
mobile technologies
human–robot interactions with VR/AR

Related Resources

MDPI-SI on DT & FIE in Ed--Scopus,JCI 2023   MDPI Education Sciences Journal - Special Issue on Digital Twins and Future Intelligent Educational Environments
UNAI 2022   2nd workshop on Universal Augmented Interaction at ISMAR
ICHVR 2022   2022 International Conference on Haptics and Virtual Reality (ICHVR 2022)
IEEE-Ei/Scopus-FSPSE 2022   [IEEE/EI/Scopus]2022 International Conference on Frontiers of Signal Processing and Software Engineering (FSPSE 2022)
(IN)TANGIBLE HERITAGE(S) 2022   (IN)TANGIBLE HERITAGE(S): A conference on design, culture and technology – past, present, and future
ICACAR 2023   2023 6th International Conference on Advanced Control, Automation and Robotics (ICACAR 2023)
IEEE ICVR 2023   2023 the 9th International Conference on Virtual Reality (ICVR 2023)--IEEE, SCI
SEKE 2023   The 35th International Conference on Software Engineering and Knowledge Engineering
ICVARS 2023   ACM--2023 the 7th International Conference on Virtual and Augmented Reality Simulations (ICVARS 2023)
MLHMI--Ei 2023   2023 4th International Conference on Machine Learning and Human-Computer Interaction (MLHMI 2023)