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R2DM 2021 : IEEE Workshop on Reliable and Resilient Digital Manufacturing 2021

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Link: https://r2dm-workshop.github.io/
 
When Sep 16, 2021 - Sep 17, 2021
Where Virtual (online)
Submission Deadline Jul 23, 2021
Notification Due Aug 30, 2021
Final Version Due Sep 10, 2021
Categories    digital manufacturing   security   additive manufacturing
 

Call For Papers

IEEE Workshop on Reliable and Resilient Digital Manufacturing
=============================================================

**Call for Contributions**

== Scope ==

We welcome contributions from academia, industry and governmental entities with interdisciplinary backgrounds to facilitate the growth of the new area of digital manufacturing. The topics of interest to the workshop include but are not limited to:

- Security and privacy in digital manufacturing
- Additive manufacturing as a Cyber-physical system
- Reliability in manufacturing ecosystems
- Artificial intelligence for manufacturing
- Signal processing and robotics for manufacturing
- Technological barriers in digital manufacturing
- Network security for digital manufacturing
- Resilient manufacturing systems and cybersecurity
- Intrusion and anomaly detection
- Standards for digital manufacturing
- Human in the loop in digital manufacturing
- Resilience metrics for manufacturing
- Control-theoretic approaches in manufacturing
- Economics of future manufacturing technologies
- Hardware-assisted digital manufacturing
- Encryption and authentication for manufacturing
- Innovations in computer-aided design
- Safety concerns in future manufacturing
- Understanding barriers/enablers in modern manufacturing

Also, of interest will be contributions that can point the research community to new research directions, and those that can set research agendas and priorities in reliable and resilient digital manufacturing.

== Contribution Guidelines ==
Acceptable submissions include:

- Systematization of Knowledge (SoK) presentations,
- Original research presentations,
- Demos, and
- Posters.

Top submissions will be invited to a special issue of IEEE Embedded System Letters (ESL) on Reliable and Resilient Digital Manufacturing.

Please submit your contributions at https://hotcrp2.engineering.nyu.edu/ (Submissions will open June 25, 2021)

== Important Dates ==

Submission Deadline: July 23, 2021 (23:59 Anywhere on Earth time)
Notification to authors: August 30, 2021 (23:59 Anywhere on Earth time)
Final versions Due: September 10, 2021 (23:59 Anywhere on Earth time)


== Organizing Committee ==
Nektarios Tsoutsos, University of Delaware
Nikhil Gupta, New York University
Ramesh Karri, New York University
Hammond Pearce, New York University

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