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ICICM--EI Compendex, Scopus 2021 : 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus

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Link: http://www.icicm.net/
 
When Oct 22, 2021 - Oct 24, 2021
Where Nanjing, China
Submission Deadline Sep 10, 2021
Categories    circuits   manufacturing   embedded systems   systems
 

Call For Papers

★ICICM 2021--IEEE Xplore,Ei Compendex and Scopus★

Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus
Abbreviation: ICICM 2021
Time: October 22-24, 2021
Place: Nanjing, China
Website: http://www.icicm.net/


(For early submission, it will get the feedback within 1 month)
==Publication: Conference Proceeding
==Indexed by: Ei Compendex, and Scopus, etc.
==Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)
==Find the tempalte with the link: http://icicm.net/files/Template.doc


★Co-sponsored by★
University of Electronic Science and Technology of China, China
Technology of China and Southeast University, China


★ICICM Committees★
Advisory Chairs
David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)
Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)

Conference Chairs
Zhigong Wang, Southeast University, China
Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter)

Program Chairs
Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)
Zou Zhuo, Fudan University, China(Senior Member of IEEE)
Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden

Steering Committee Chair
Huang Le Tian, University of Electronic Science and Technology of China, China

Technical Committee
Zhenhai Chen, Hefei University of Technology, China
Junji Cheng, University of Electronic Science and Technology of China, China
Pan Dai, Huzhou University, China
Quanzhen Duan, Tianjin University of Technology, China
Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia
Shengming Huang, Tianjin University of Technology, China
Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan
Xiangliang Jin, Hunan Normal University, China
Biba Josef, Universität der Bundeswehr München, Germany
Atsushi Kurokawa, Hirosaki University, Japan
Wen Cheng Lai, National Taiwan University of Science and Technology, Taiwan
Qi Li, Guilin University of Electronic Technology, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Chunyi Song, Zhejiang University, China
Haizhi Song, University of Electronic Science and Technology of China, China
Jiajia Sun, China Academy of Space Technology, China
Lu Tang, Southeast University, China
Somboon Theerawisitpong, Rajamangala University of Technology Thanyaburi, Thailand
Wensi Wang, Beijing University of Technology, China
Weilin Xu, Guilin University of Electronic Technology, China
Jong-Ryul Yang, Yeungnam University, South Korea
Changchun Zhang, Nanjing University of Posts and Telecommunications, China
For more members, please visite conference website: http://www.icicm.net/committee.html


★History★

Papers of ICICM2020 can be checked in IEEE Xplore!
Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2


Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1


Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5


Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0


Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3


★Topics★
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)


★Conference schedule★
1) October 22, 2021—Conference Materials Collection
2) October 23, 2021—Keynote Speeches & Authors' Presentations
3) October 24, 2021—Keynote/Invited Speeches & Authors' Presentations & Poster Presentations

★Conference Contact★
Ms Zeng
Email: icicm@young.ac.cn
Tel: +86-28-87777577
Web: www.icicm.net

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