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ICICM--EI Compendex, Scopus 2021 : 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus | |||||||||||
Link: http://www.icicm.net/ | |||||||||||
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★ICICM 2021--IEEE Xplore,Ei Compendex and Scopus★
Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus Abbreviation: ICICM 2021 Time: October 22-24, 2021 Place: Nanjing, China Website: http://www.icicm.net/ (For early submission, it will get the feedback within 1 month) ==Publication: Conference Proceeding ==Indexed by: Ei Compendex, and Scopus, etc. ==Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021) ==Find the tempalte with the link: http://icicm.net/files/Template.doc ★Co-sponsored by★ University of Electronic Science and Technology of China, China Technology of China and Southeast University, China ★ICICM Committees★ Advisory Chairs David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow) Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow) Conference Chairs Zhigong Wang, Southeast University, China Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter) Program Chairs Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow) Zou Zhuo, Fudan University, China(Senior Member of IEEE) Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden Steering Committee Chair Huang Le Tian, University of Electronic Science and Technology of China, China Technical Committee Zhenhai Chen, Hefei University of Technology, China Junji Cheng, University of Electronic Science and Technology of China, China Pan Dai, Huzhou University, China Quanzhen Duan, Tianjin University of Technology, China Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia Shengming Huang, Tianjin University of Technology, China Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan Xiangliang Jin, Hunan Normal University, China Biba Josef, Universität der Bundeswehr München, Germany Atsushi Kurokawa, Hirosaki University, Japan Wen Cheng Lai, National Taiwan University of Science and Technology, Taiwan Qi Li, Guilin University of Electronic Technology, China Weiguang Sheng, Shanghai Jiao Tong University, China Chunyi Song, Zhejiang University, China Haizhi Song, University of Electronic Science and Technology of China, China Jiajia Sun, China Academy of Space Technology, China Lu Tang, Southeast University, China Somboon Theerawisitpong, Rajamangala University of Technology Thanyaburi, Thailand Wensi Wang, Beijing University of Technology, China Weilin Xu, Guilin University of Electronic Technology, China Jong-Ryul Yang, Yeungnam University, South Korea Changchun Zhang, Nanjing University of Posts and Telecommunications, China For more members, please visite conference website: http://www.icicm.net/committee.html ★History★ Papers of ICICM2020 can be checked in IEEE Xplore! Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2 Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1 Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5 Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0 Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3 ★Topics★ Digital, Analog, Mixed Signal IC and SOC design technology Silicon integrated circuits and manufacturing Low-power, RF devices & circuits IC Computer-Aided –Design technology, DFM Silicon/germanium devices and device physics Interconnect, Low K, High K and other process technologies Unconventional and nano-electronics Organic semiconductor devices and technologies Compound semiconductor devices and circuits Displays, sensors and MEMS Semiconductor materials and material characterization Packaging and testing technology Solar cell & other devices for new energy sources Modeling and simulation Equipment technology Reliability Displays, sensors and MEMS Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.) ★Conference schedule★ 1) October 22, 2021—Conference Materials Collection 2) October 23, 2021—Keynote Speeches & Authors' Presentations 3) October 24, 2021—Keynote/Invited Speeches & Authors' Presentations & Poster Presentations ★Conference Contact★ Ms Zeng Email: icicm@young.ac.cn Tel: +86-28-87777577 Web: www.icicm.net |
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