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IEEE DAPPS 2021 : IEEE International Conference on Decentralized Applications and Infrastructures

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Link: https://ieeedapps.net/
 
When Aug 23, 2021 - Aug 26, 2021
Where Online Event
Submission Deadline Apr 27, 2021
Notification Due Jun 14, 2021
Final Version Due Jun 28, 2021
 

Call For Papers

On behalf of the organizing committee,

We cordially invite you to submit your contributions to the 3rd IEEE International Conference on Decentralized Applications and Infrastructures (IEEE DAPPS 2021).

Why DAPPS?

The objective of the IEEE DAPPS 2021 is to facilitate the exchange between researchers and practitioners in the area of Decentralized Applications based on Distributed Ledger Technologies, Blockchains and related technologies. The conference will be co-located with IEEE SOSE, IEEE Mobile Cloud, IEEE BigDataService, IEEE AITest, and IEEE JCC.
What to submit?

Two different types of papers can be submitted:
Regular papers (10 pages IEEE double column format)
Short papers (6 pages IEEE double column format)


Topics of interest include, but are not limited to:
Distributed Ledger Technologies (DLT)
Smart contract theory
Languages and tools for (secure) dApps
Infrastructures for dApps
Communication protocols and standards for dApps
Decentralized identity
Identity management for dApps
Token Economy
Off-chain dApps
dApps/DLT/Blockchain analytics
dApps/DLT/Blockchain governance
dApps/DLT/Blockchain interoperability
dApps/DLT/Blockchain privacy
dApps/DLT/Blockchain security
dApps/DLT/Blockchain scalability, sharding, and performance
dApps/DLT/Blockchain policy/law
dApps/DLT/Blockchain applications in areas such as Internet of Things, logistics, supply chain, or health
dApps/DLT/Blockchain emerging research topics


Important Dates:
Apr. 27, 2021: Paper submission deadline
Jun. 14, 2021: Author notification
Jun. 28, 2021: Camera-ready submission and conference registration

For more detailed information, please check https://ieeedapps.net.

The DAPPs 2021 PC co-chairs
Pedro Moreno-Sanchez (IMDEA Software Institute, Madrid, Spain)
Clara Schneidewind (TU Wien, Vienna, Austria & MPI-SP, Bochum, Germany)
Contact email: pc-chairs@ieeedapps.net

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