IEEE IRI 2021 : IEEE 22nd International Conference on Information Reuse and Integration for Data Science
Call For Papers
CALL FOR PAPERS
IEEE 22nd International Conference
on Information Reuse and Integration for Data Science (IEEE IRI 2021)
August 10 - August 12, 2021. ** Taking Place Virtually **
CFP URL: https://homepages.uc.edu/~niunn/IRI21/resources/IEEE-IRI21-CfP-Dec23.pdf
Intelligent applications derive from Information Reuse and Integration (IRI) and data science. IRI seeks to maximize the utility of information by creating simple cost-effective representations of knowledge. IRI consequently explores strategies for integrating this knowledge into systems and applications.
Call for Papers
This conference and its constituents support the development of science and technology to improve the human condition. The conference includes, but is certainly not limited to, the areas listed below:
- Applications – Autonomous Vehicles, Business, Education, Engineering, Healthcare and Medical Informatics, the Internet of Things, Math, Military, Multimedia, NLP, Robotics, Science, Security, Social Networking, Space, Vision, etc.
- Data & Knowledge Representation and Management
- Data Science & Technologies - Heuristic Acquisition
- Data Visualization
- Machine Learning & AI
- AI and Security
- Evolutionary Techniques
- Statistical Analysis
- Information Science Theory
Best Paper Award:
The best papers will be selected by distinct (cleared) committees and will be the ones, which report novel and promising research work, which have a high potential for world impact. Additional select awards will also be made.
** Journal Special Issues will be organized to include the top papers accepted into IRI’21. **
Call for Workshop Proposals: Please find the call here -
Deadline (full paper research/industry/application/government track): extended to: May 14, 2021
Deadline (short paper, poster, and demo paper): May 17, 2021
Full paper acceptance notification: June 11, 2021
Short paper, poster, and demo paper acceptance notification: June 11, 2021
Camera ready submission deadline: June 18, 2021
Author registration due: July 2, 2021
Conference events: August 10 - Aug 12, 2021
Papers reporting original and unpublished research results pertaining to the above and related topics are solicited. Full/regular papers must be in English of up to 8 pages (using the IEEE two-column template instructions). Six pages is typical and allows for extension of invited papers being extended for journal publication. Poster and demo papers are up to 4 and 2 pages, respectively. Full paper submissions can be made to the regular research track or to the industry/application track.
Submissions should be double blind and should include only the title and should not include the author(s), affiliation(s), e-mail address(es), tel/fax numbers, and postal address(es) in the paper. The online submission site is: https://easychair.org/conferences/?conf=iri21.
The authors need to mark if their submission is for the “Regular Research Track”, or for the “Industry/Applications Track”.
If web submission is not possible, please contact the program co-chair, Dr. Danda Rawat (firstname.lastname@example.org) for alternate arrangements. Papers will be selected based on their originality, timeliness, significance, relevance, and clarity of presentation. Paper submission implies the intent of at least one of the authors to register and present the paper, if accepted. We may allow international telecoms for the presentation of registered international papers.
Stuart Rubin, SPAWAR Systems Center Pacific (SSC-Pacific), USA
Shu-Ching Chen, Florida International University, USA
Danda B. Rawat, Howard University, USA
Nan Niu, University of Cincinnati, USA
Industry/Application Track Co-Chairs
Lin Shi, Chinese Academy of Sciences, China
Wentao Wang, Oracle, USA
Shaoen Wu, Illinois State University, USA
Wei-Bang Chen, Virginia State University, USA
Lydia Bouzar-Benlabiod, Ecole Nationale Supérieure d'Informatique, Algeria
Al-Sakib Khan Pathan, Independent University, Bangladesh
Wenjia Li, New York Institute of Technology, USA
Chengcui Zhang, University of Alabama at Birmingham, USA